Inventor · disambiguated record
Chung Yu Wang
Also filed as: WANG CHUNG Y · WANG CHUNG YU
36 granted patents·5 pending applications·880 citations·filing 2001–2015
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG17WANG CHUNG-YU13TSMC SOLID STATE LIGHTING LTD2WU CHIH-HSIEN2CHEN CHIH-HAO1
Top patents by PatentIndex Score
41 records- 0199US7361990B2Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump padsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Apr 22, 2008·134 cites·15 claims
- 0298US8183579B2LED flip-chip package structure with dummy bumpsWANG CHUNG YU·Filed 2010·Granted May 22, 2012·133 cites·15 claims
- 0398US8183578B2Double flip-chip LED package componentsWANG CHUNG YU·Filed 2010·Granted May 22, 2012·136 cites·20 claims
- 0495US8580683B2Apparatus and methods for molding die on wafer interposersWANG CHUNG YU·Filed 2011·Granted Nov 12, 2013·20 cites·16 claims
- 0594US6770958B2Under bump metallization structureTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Aug 3, 2004·80 cites·4 claims
- 0693US9337096B2Apparatus and methods for molding die on wafer interposersTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 10, 2016·12 cites·20 claims
- 0793US6787926B2Wire stitch bond on an integrated circuit bond pad and method of making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Sep 7, 2004·85 cites·24 claims
- 0892US8408734B2Structure of lighting deviceWU CHIH-HSIEN·Filed 2010·Granted Apr 2, 2013·17 cites·12 claims
- 0992US7112522B1Method to increase bump height and achieve robust bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 26, 2006·25 cites·15 claims
- 1090US8390009B2Light-emitting diode (LED) package systemsWANG CHUNG YU·Filed 2010·Granted Mar 5, 2013·11 cites·19 claims
- 1189US8501590B2Apparatus and methods for dicing interposer assemblyWANG CHUNG YU·Filed 2011·Granted Aug 6, 2013·8 cites·16 claims
- 1289US6596619B1Method for fabricating an under bump metallization structureTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 22, 2003·48 cites·11 claims
- 1388US9337063B2Package for three dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 10, 2016·8 cites·18 claims
- 1488US6782897B2Method of protecting a passivation layer during solder bump formationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 31, 2004·52 cites·18 claims
- 1585US8399269B2LED flip-chip package structure with dummy bumpsWANG CHUNG-YU·Filed 2012·Granted Mar 19, 2013·6 cites·21 claims
- 1685US7446398B2Bump pattern design for flip chip semiconductor packageTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 4, 2008·15 cites·18 claims
- 1784US8492263B2Protected solder ball joints in wafer level chip-scale packagingWANG CHUNG YU·Filed 2007·Granted Jul 23, 2013·11 cites·13 claims
- 1883US8900893B2Vertical LED chip package on TSV carrierWANG CHUNG YU·Filed 2010·Granted Dec 2, 2014·6 cites·20 claims
- 1982US8183580B2Thermally-enhanced hybrid LED package componentsWANG CHUNG YU·Filed 2010·Granted May 22, 2012·6 cites·20 claims
- 2081US9136211B2Protected solder ball joints in wafer level chip-scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 15, 2015·5 cites·19 claims
- 2174US8772929B2Package for three dimensional integrated circuitCHEN CHIH-HAO·Filed 2011·Granted Jul 8, 2014·3 cites·14 claims
- 2272US8486724B2Wafer level reflector for LED packagingKU HAO-WEI·Filed 2010·Granted Jul 16, 2013·4 cites·20 claims
- 2370US8628984B2Light-emitting diode (LED) package systemsTSMC SOLID STATE LIGHTING LTD·Filed 2013·Granted Jan 14, 2014·2 cites·19 claims
- 2470US8046106B2Controlling method and system for saving energy of buildingINST INFORMATION INDUSTRY·Filed 2008·Granted Oct 25, 2011·5 cites·30 claims
- 2570US6774026B1Structure and method for low-stress concentration solder bumpsTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 10, 2004·14 cites·8 claims
- 2669US6528417B1Metal patterned structure for SiN surface adhesion enhancementTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Mar 4, 2003·24 cites·36 claims
- 2767US8816495B2Structures and formation methods of packages with heat sinksWANG CHUNG YU·Filed 2012·Granted Aug 26, 2014·2 cites·16 claims
- 2866US10269731B2Apparatus for dicing interposer assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·1 cites·20 claims
- 2960US8642390B2Tape residue-free bump area after wafer back grindingWANG CHUNG YU·Filed 2010·Granted Feb 4, 2014·1 cites·20 claims
- 3057US9362474B2Vertical LED chip package on TSV carrierEPISTAR CORP·Filed 2014·Granted Jun 7, 2016·0 cites·13 claims
- 3155US8946893B2Apparatus for dicing interposer assemblyTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 3, 2015·0 cites·20 claims
- 3254US7443010B2Matrix form semiconductor package substrate having an electrode of serpentine shapeTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Oct 28, 2008·6 cites·17 claims
- 3352US2012204951A1Phosphor-contained solar cell and method thereofWANG CHUNG-YU·Filed 2011·Application pending·0 cites
- 3451US9343505B2Wafer level reflector for LED packagingTSMC SOLID STATE LIGHTING LTD·Filed 2013·Granted May 17, 2016·0 cites·1 claims
- 3549US2008142994A1Contact Pad And Bump Pad Arrangement for High-Lead Or Lead-Free BumpsLU SZU WEI·Filed 2008·Application pending·0 cites
- 3644US7662665B2Method for fabricating a semiconductor package including stress relieving layer for flip chip packagingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Feb 16, 2010·0 cites·19 claims
- 3744US2011317409A1Structure of lighting deviceWU CHIH-HSIEN·Filed 2010·Application pending·0 cites
- 3843US8629043B2Methods for de-bonding carriersWANG CHUNG YU·Filed 2011·Granted Jan 14, 2014·0 cites·19 claims
- 3942US2007238283A1Novel under-bump metallization for bond pad solderingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 4040US2004217482A1Structure and method for low-stress concentration solder bumpsFiled 2004·Application pending·0 cites
- 4139US7833896B2Aluminum cap for reducing scratch and wire-bond bridging of bond padsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Nov 16, 2010·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →