Inventor

LIM DONG-CHAN

KR43 patents

⚠️ This page may combine multiple inventors who share the name “LIM DONG-CHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIM DONG-CHAN

SAMSUNG ELECTRONICS CO LTD

Semiconductor device, semiconductor package and method of manufacturing the same

Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices

Semiconductor devices including high-k dielectric materials

Semiconductor device including TSV and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Method of forming a gate of a semiconductor device

Electrode connecting structures containing copper

Semiconductor device

Semiconductor device including an ohmic layer

Semiconductor devices having polymetal gate electrodes

Method of forming a semiconductor device including an ohmic layer

Apparatus for etching substrate bevel and semiconductor fabrication method using the same

Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices

Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices

Semiconductor chips and methods of forming the same

Semiconductor device

Semiconductor device, semiconductor package and method of manufacturing the same

Semiconductor device having a through silicon via and methods of manufacturing the same

Semiconductor device

Integrated circuit device and method of manufacturing the same

Semiconductor chips and methods of manufacturing the same

Semiconductor device having a through silicon via and methods of manufacturing the same

Integrated circuit device and method of manufacturing the same

Semiconductor device

Semiconductor device including TSV and method of manufacturing the same

Semiconductor device

Methods of forming semiconductor devices with extended active regions

Ion beam source, substrate process apparatus including the same, and method of processing a substrate using the same

Semiconductor device and method of fabricating the same

Semiconductor device and method of fabricating the same

PARK BYUNG-LYUL

Semiconductor device and method of fabricating the same including a conductive structure is formed through at least one dielectric layer after forming a via structure

Integrated circuit having through silicon via structure with minimized deterioration

Methods of manufacturing a semiconductor device

Semiconductor device and method of fabricating the same

MOON KWANG-JIN

Semiconductor device and method of fabricating the same

Semiconductor device and method of fabricating the same

Method of manufacturing a semiconductor device and method of manufacturing a semiconductor package including the same

JUNG DEOK-YOUNG

Method of forming semiconductor device

KIM SU-KYOUNG

Integrated circuit device including through-silicon via structure having offset interface

LIM DONG-CHAN

Via structures and semiconductor devices having the via structures

KOREA INST MACH & MATERIALS

Current collector for battery comprising metal mesh layer and manufacturing method therefor

LEE CHANG-SU

System and method for transmitting personal networking-based blog post, and server applied to the same

KIM YOUNG DOK

Method of coating surface of inorganic powder particles with silicon-carbon composite and inorganic powder particles coated by the same