Inventor · disambiguated record
Arvind K. Sinha
Also filed as: SINHA ARVIND · SINHA ARVIND K · SINHA ARVIND KUMAR
110 granted patents·12 pending applications·1,197 citations·filing 1999–2018
99Inventor score
Top patents by PatentIndex Score
122 records- 0198US8961280B2Method of manufacturing a venting device for tamper resistant electronic modulesDANGLER JOHN RICHARD·Filed 2012·Granted Feb 24, 2015·65 cites·26 claims
- 0298US8287336B2Method of manufacturing a venting device for tamper resistant electronic modulesDANGLER JOHN RICHARD·Filed 2007·Granted Oct 16, 2012·72 cites·18 claims
- 0397US9414526B2Cooling apparatus with dynamic load adjustmentGLOBALFOUNDRIES INC·Filed 2013·Granted Aug 9, 2016·31 cites·18 claims
- 0497US8911244B2Receptacle with heat management for electronic and optical systemsIBM·Filed 2012·Granted Dec 16, 2014·44 cites·8 claims
- 0597US7298623B1Organic substrate with integral thermal dissipation channels, and method for producing sameIBM·Filed 2006·Granted Nov 20, 2007·53 cites·18 claims
- 0696US6970360B2Tamper-proof enclosure for a circuit cardIBM·Filed 2004·Granted Nov 29, 2005·127 cites·16 claims
- 0795US7499279B2Cold plate stabilityIBM·Filed 2007·Granted Mar 3, 2009·30 cites·11 claims
- 0895US7486516B2Mounting a heat sink in thermal contact with an electronic componentIBM·Filed 2005·Granted Feb 3, 2009·32 cites·2 claims
- 0995US7214874B2Venting device for tamper resistant electronic modulesIBM·Filed 2004·Granted May 8, 2007·77 cites·22 claims
- 1094US9609744B2Area array device connection structures with complimentary warp characteristicsIBM·Filed 2015·Granted Mar 28, 2017·10 cites·14 claims
- 1193US6385044B1Heat pipe heat sink assembly for cooling semiconductor chipsIBM·Filed 2001·Granted May 7, 2002·88 cites·18 claims
- 1292US8544337B2Piezoelectric chromic impact sensorKUCZYNSKI JOSEPH·Filed 2010·Granted Oct 1, 2013·16 cites·4 claims
- 1392US7606033B2Mounting a heat sink in thermal contact with an electronic componentIBM·Filed 2008·Granted Oct 20, 2009·18 cites·20 claims
- 1491US9482833B1Light pipe connector apparatusIBM·Filed 2015·Granted Nov 1, 2016·8 cites·6 claims
- 1591US8952258B2Implementing graphene interconnect for high conductivity applicationsIBM·Filed 2012·Granted Feb 10, 2015·21 cites·19 claims
- 1691US7777329B2Heatsink apparatus for applying a specified compressive force to an integrated circuit deviceIBM·Filed 2006·Granted Aug 17, 2010·24 cites·9 claims
- 1791US7751918B2Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold platesIBM·Filed 2007·Granted Jul 6, 2010·26 cites·20 claims
- 1891US7382620B2Method and apparatus for optimizing heat transfer with electronic componentsIBM·Filed 2005·Granted Jun 3, 2008·22 cites·16 claims
- 1990US9245813B2Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performanceIBM·Filed 2013·Granted Jan 26, 2016·13 cites·13 claims
- 2090US8716597B2Implementing enhanced dimensional stability with graphite nanotube hybrid socketMANN PHILLIP V·Filed 2012·Granted May 6, 2014·11 cites·18 claims
- 2190US6475011B1Land grid array socket actuation hardware for MCM applicationsIBM·Filed 2001·Granted Nov 5, 2002·52 cites·14 claims
- 2287US7903411B2Cold plate stabilityIBM·Filed 2008·Granted Mar 8, 2011·12 cites·10 claims
- 2387US7832096B2Method for producing an organic substrate with integral thermal dissipation channelsIBM·Filed 2007·Granted Nov 16, 2010·11 cites·13 claims
- 2487US6449155B1Land grid array subassembly for multichip modulesIBM·Filed 2001·Granted Sep 10, 2002·48 cites·14 claims
- 2586US9976812B2Dual magnetically coupled rotor heat exchangerIBM·Filed 2015·Granted May 22, 2018·5 cites·20 claims
- 2686US7352575B2Dynamic air moving systemIBM·Filed 2006·Granted Apr 1, 2008·15 cites·7 claims
- 2785US9590329B2Pin attach converterIBM·Filed 2015·Granted Mar 7, 2017·6 cites·17 claims
- 2884US7944698B2Mounting a heat sink in thermal contact with an electronic componentIBM·Filed 2008·Granted May 17, 2011·9 cites·20 claims
- 2983US9482349B2Air valve for electronics enclosuresIBM·Filed 2014·Granted Nov 1, 2016·6 cites·10 claims
- 3082US9523432B2Air valve for electronics enclosuresIBM·Filed 2015·Granted Dec 20, 2016·3 cites·10 claims
- 3182US8431048B2Method and system for alignment of graphite nanofibers for enhanced thermal interface material performanceKUCZYNSKI JOSEPH·Filed 2010·Granted Apr 30, 2013·3 cites·19 claims
- 3282US8289712B2Flux-free detachable thermal interface between an integrated circuit device and a heat sinkHOLAHAN MAURICE F·Filed 2010·Granted Oct 16, 2012·8 cites·6 claims
- 3381US9111899B2Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacksBARTLEY GERALD K·Filed 2012·Granted Aug 18, 2015·5 cites·13 claims
- 3481US7354281B1Method and apparatus for restricting rotational moment about a longitudinal axis of SMT connectorsIBM·Filed 2007·Granted Apr 8, 2008·5 cites·6 claims
- 3580US10126070B2Demand-based charging of a heat pipeIBM·Filed 2017·Granted Nov 13, 2018·2 cites·14 claims
- 3680US7438557B1Stacked multiple electronic component interconnect structureIBM·Filed 2007·Granted Oct 21, 2008·9 cites·2 claims
- 3779US9392731B2Cooling apparatus with dynamic load adjustmentGLOBALFOUNDRIES INC·Filed 2014·Granted Jul 12, 2016·4 cites·20 claims
- 3879US9247636B2Area array device connection structures with complimentary warp characteristicsIBM·Filed 2013·Granted Jan 26, 2016·4 cites·19 claims
- 3979US9170056B2Duplex flexible heat exchangerHOLAHAN MAURICE F·Filed 2010·Granted Oct 27, 2015·5 cites·12 claims
- 4079US7438558B1Three-dimensional stackable die configuration for an electronic circuit boardIBM·Filed 2007·Granted Oct 21, 2008·8 cites·5 claims
- 4178US10156403B2Demand-based charging of a heat pipeIBM·Filed 2016·Granted Dec 18, 2018·2 cites·9 claims
- 4278US9863712B2Demand-based charging of a heat pipeIBM·Filed 2015·Granted Jan 9, 2018·2 cites·13 claims
- 4378US6634095B2Apparatus for mounting a land grid array moduleIBM·Filed 2001·Granted Oct 21, 2003·19 cites·13 claims
- 4477US8611090B2Electronic module with laterally-conducting heat distributor layerSINHA ARVIND K·Filed 2010·Granted Dec 17, 2013·4 cites·13 claims
- 4576US9721855B2Alignment of three dimensional integrated circuit componentsIBM·Filed 2014·Granted Aug 1, 2017·3 cites·10 claims
- 4676US8558564B2Heat spreader flatness detectionSINHA ARVIND K·Filed 2011·Granted Oct 15, 2013·2 cites·20 claims
- 4775US9835384B2Demand-based charging of a heat pipeIBM·Filed 2015·Granted Dec 5, 2017·1 cites·14 claims
- 4875US9096784B2Method and system for allignment of graphite nanofibers for enhanced thermal interface material performanceKUCZYNSKI JOSEPH·Filed 2013·Granted Aug 4, 2015·2 cites·17 claims
- 4974US6757965B2Method of installing a land grid array multi-chip modulesIBM·Filed 2003·Granted Jul 6, 2004·15 cites·5 claims
- 5074US6534964B1Apparatus and method for determining stiffness properties of an anisotropic electronic substrate using scanning acoustic microscopyIBM·Filed 2000·Granted Mar 18, 2003·11 cites·14 claims
Showing the top 50 of 122 patent records by PatentIndex Score.
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