Inventor · disambiguated record
Sih-Dian Lee
Also filed as: LEE SIH-DIAN
2 granted patents·1 pending application·20 citations·filing 2007–2011
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0185US7981727B2Electronic device wafer level scale packages and fabrication methods thereofLIU CHIEN-HUNG·Filed 2007·Granted Jul 19, 2011·17 cites·10 claims
- 0269US8309398B2Electronic device wafer level scale packages and fabrication methods thereofLIU CHIEN-HUNG·Filed 2011·Granted Nov 13, 2012·3 cites·10 claims
- 0341US2009050995A1Electronic device wafer level scale packges and fabrication methods thereofXINTEC INC·Filed 2007·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →