Inventor
CHENG NAI-WEN
TW15 patents
⚠️ This page may combine multiple inventors who share the name “CHENG NAI-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
5 patentsUS10867891B2Dec 15, 2020
Ion through-substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10074680B2Sep 11, 2018
Image sensor with low step height between back-side metal and pixel array
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11646247B2May 9, 2023
Ion through-substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11552027B2Jan 10, 2023
Semiconductor packaging device comprising a shield structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11037885B2Jun 15, 2021
Semiconductor packaging device comprising a shield structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
HSIAO RU-SHANG
4 patentsUS8546860B2Oct 1, 2013
Stress engineering to reduce dark current of CMOS image sensors
HSIAO RU-SHANG1 citations61
US8216905B2Jul 10, 2012
Stress engineering to reduce dark current of CMOS image sensors
HSIAO RU-SHANG1 citations61
US8778717B2Jul 15, 2014
Local oxidation of silicon processes with reduced lateral oxidation
HSIAO RU-SHANG0 citations50
US8389377B2Mar 5, 2013
Sensor element isolation in a backside illuminated image sensor
HSIAO RU-SHANG1 citations50