Inventor
TSAI TENG-CHUN
TW215 patents
⚠️ This page may combine multiple inventors who share the name “TSAI TENG-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
26 patentsUS9502265B1Nov 22, 2016
Vertical gate all around (VGAA) transistors and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD938 citations98
US10490458B2Nov 26, 2019
Methods of cutting metal gates and structures formed thereof
TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US11545400B2Jan 3, 2023
Methods of cutting metal gates and structures formed thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations86
US10529833B2Jan 7, 2020
Integrated circuit with a fin and gate structure and method making the same
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations86
US11152267B2Oct 19, 2021
Methods of cutting metal gates and structures formed thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US11004794B2May 11, 2021
Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10861752B2Dec 8, 2020
Methods of cutting metal gates and structures formed thereof
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US10727065B2Jul 28, 2020
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10510580B2Dec 17, 2019
Dummy fin structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10505014B2Dec 10, 2019
Vertical device having a protrusion source
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10157995B2Dec 18, 2018
Integrating junction formation of transistors with contact formation
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9853102B2Dec 26, 2017
Tunnel field-effect transistor
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9780214B2Oct 3, 2017
Semiconductor device including Fin- FET and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9768303B2Sep 19, 2017
Method and structure for FinFET device
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9768024B1Sep 19, 2017
Multi-layer mask and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9236446B2Jan 12, 2016
Barc-assisted process for planar recessing or removing of variable-height layers
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US9994736B2Jun 12, 2018
Slurry composition for chemical mechanical polishing of GE-based materials and devices
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US9812358B1Nov 7, 2017
FinFET structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations83
US9592585B2Mar 14, 2017
System and method for CMP station cleanliness
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US9530655B2Dec 27, 2016
Slurry composition for chemical mechanical polishing of Ge-based materials and devices
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US9281192B2Mar 8, 2016
CMP-friendly coatings for planar recessing or removing of variable-height layers
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US10714395B2Jul 14, 2020
Fin isolation structure for FinFET and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations82
US12009253B2Jun 11, 2024
Semiconductor structure with staggered selective growth
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11916131B2Feb 27, 2024
Vertical device having a protrusion source
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11664268B2May 30, 2023
Dummy fin structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11398381B2Jul 26, 2022
Method for forming semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
UNITED MICROELECTRONICS CORP
10 patentsUS6831013B2Dec 14, 2004
Method of forming a dual damascene via by using a metal hard mask layer
UNITED MICROELECTRONICS CORP36 citations93
US6544373B2Apr 8, 2003
Polishing pad for a chemical mechanical polishing process
UNITED MICROELECTRONICS CORP42 citations93
US6638830B1Oct 28, 2003
Method for fabricating a high-density capacitor
UNITED MICROELECTRONICS CORP32 citations92
US6593185B1Jul 15, 2003
Method of forming embedded capacitor structure applied to logic integrated circuit
UNITED MICROELECTRONICS CORP45 citations92
US6316323B1Nov 13, 2001
Method for forming bridge free silicide by reverse spacer
UNITED MICROELECTRONICS CORP25 citations91
US7485515B2Feb 3, 2009
Method of manufacturing metal oxide semiconductor
UNITED MICROELECTRONICS CORP8 citations84
US6524962B2Feb 25, 2003
Method for forming dual-damascene interconnect structure
UNITED MICROELECTRONICS CORP13 citations84
US7238586B2Jul 3, 2007
Seamless trench fill method utilizing sub-atmospheric pressure chemical vapor deposition technique
UNITED MICROELECTRONICS CORP16 citations83
US6251711B1Jun 26, 2001
Method for forming bridge free silicide
UNITED MICROELECTRONICS CORP15 citations83
US6461230B1Oct 8, 2002
Chemical-mechanical polishing method
UNITED MICROELECTRONICS CORP9 citations74
TAIWAN SEMICONDUCTOR MFG
5 patentsUS9224833B2Dec 29, 2015
Method of forming a vertical device
TAIWAN SEMICONDUCTOR MFG33 citations98
US8889497B2Nov 18, 2014
Semiconductor devices and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG22 citations92
US9318447B2Apr 19, 2016
Semiconductor device and method of forming vertical structure
TAIWAN SEMICONDUCTOR MFG6 citations84
US9287170B2Mar 15, 2016
Contact structure and formation thereof
TAIWAN SEMICONDUCTOR MFG8 citations83
US9048087B2Jun 2, 2015
Methods for wet clean of oxide layers over epitaxial layers
TAIWAN SEMICONDUCTOR MFG8 citations83
CHIEN CHIN-CHENG
2 patentsTSAI SHIH-HUNG
1 patentHSU CHUN-WEI
1 patentLIU CHIH-CHIEN
1 patentLIN CHIN-FU
1 patentTSAI TENG-CHUN
1 patentLIAO PO-JUI
1 patentCHEN JEI-MING
1 patentShowing the top 50 of 215 patents by PatentIndex Score.