Inventor

KESSLER ANGELA

DE48 patents

⚠️ This page may combine multiple inventors who share the name “KESSLER ANGELA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KESSLER ANGELA

INFINEON TECHNOLOGIES AG

Semiconductor device having a sensor chip, and method for producing the same

Sensor component with a cavity housing and a sensor chip and method for producing the same

Molded package with chip carrier comprising brazed electrically conductive layers

Package with interconnections having different melting temperatures

Semiconductor module with at least two substrates

Power semiconductor device in lead frame employing connecting element with conductive film

Semiconductor module having discrete components and method for producing the same

Semiconductor component including semiconductor chip and method for producing the same

Semiconductor device with semiconductor chip and method for producing it

Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof

Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same

Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same

Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same

Die package and method of manufacturing a die package

Chip carrier configured for delamination-free encapsulation and stable sintering

Circuit board embedding a power semiconductor chip

Chip arrangement and method for producing a chip arrangement

Semiconductor package and passive element with interposer

Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure

Semiconductor chip comprising a metal coating structure and associated production method

Layer between interfaces of different components in semiconductor devices

Lead structure for a semiconductor component and method for producing the same

Semiconductor package and passive element with interposer

Package comprising chip contact element of two different electrically conductive materials

Package with clip having through hole accommodating component-related structure

Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages

Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages

Integration of current measurement in wiring structure of an electronic circuit

Component arrangement comprising a carrier

Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite

Semiconductor devices including parallel electrically conductive layers

Semiconductor component having a stack of semiconductor chips and method for producing the same

Embedded package with shielding pad

Molded package with chip carrier comprising brazed electrically conductive layers

Semiconductor device package thermally coupled to passive element

Plastic housing composition for embedding semiconductor devices in a plastic housing and use of the plastic housing composition

Electronic module with a semiconductor chip and a component housing and methods for producing the same

Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet

INFINEON TECHNOLOGIES AUSTRIA AG

Voltage regulator module with inductor-cooled power stage

Method of forming a semiconductor module

Semiconductor module

Semiconductor module having a multi-branch switch node connector

Semiconductor module

MAHLER JOACHIM

Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material

Semiconductor component and production method

Chip arrangement and method for producing a chip arrangement

Semiconductor component and production method

INFINEON TECHNOLOGIES AUSTRIA

Semiconductor device including multiple semiconductor chips and a laminate