Inventor · disambiguated record
Michael Töpper
Also filed as: TOEPPER MICHAEL · TOPPER MICHAEL · TÖPPER MICHAEL
5 granted patents·3 pending applications·18 citations·filing 2006–2023
70Inventor score
Files withFRAUNHOFER GES FORSCHUNG3UNIV JOHNS HOPKINS2FRAUNHOFER GES ZUR FOERDERUND DER ANGEWANDTEN FORSCHUNG E V1SOLZBACHER FLORIAN1UNIV UTAH RES FOUND1
Top patents by PatentIndex Score
8 records- 0184US7388288B2Flip chip metallization method and devicesUNIV UTAH RES FOUND·Filed 2006·Granted Jun 17, 2008·15 cites·20 claims
- 0266US2024156850A1Compositions and methods for treating solid tumorsUNIV JOHNS HOPKINS·Filed 2023·Application pending·0 cites
- 0352US8521303B2In vivo implantable coil assemblySOLZBACHER FLORIAN·Filed 2007·Granted Aug 27, 2013·3 cites·28 claims
- 0448US2018250320A1Compositions and methods for treating solid tumorsUNIV JOHNS HOPKINS·Filed 2016·Application pending·0 cites
- 0542US2009273910A1Functional Unit And Method For The Production ThereofFRAUNHOFER GES FORSCHUNG·Filed 2009·Application pending·0 cites
- 0641US12358826B2Method of joining glass elements with material continuity, glass component, and housing, and vacuum insulating glass panel comprising the glass componentFRAUNHOFER GES ZUR FOERDERUND DER ANGEWANDTEN FORSCHUNG E V·Filed 2022·Granted Jul 15, 2025·0 cites·14 claims
- 0741US10134707B2Bonding method for connecting two wafersFRAUNHOFER GES FORSCHUNG·Filed 2017·Granted Nov 20, 2018·0 cites·16 claims
- 0830US10403576B2Method for manufacturing an electronic component and an electronic componentFRAUNHOFER GES FORSCHUNG·Filed 2016·Granted Sep 3, 2019·0 cites·11 claims
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