Inventor

KONDO KAZUNORI

JP51 patents

⚠️ This page may combine multiple inventors who share the name “KONDO KAZUNORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KONDO KAZUNORI

SHINETSU CHEMICAL CO

Carrier substrate for handling

Photosensitive resin composition, photosensitive dry film, photosensitive resin coating, and pattern forming process

Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same

Semiconductor device, making method, and laminate

Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device

Silicone resin, resin composition, resin film, semiconductor device, and making method

Adhesive composition, and adhesive sheet, semiconductor apparatus-protective material and semiconductor apparatus using the same

Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

Liquid radiation-curable resin composition, optical fiber coating composition, and optical fiber

Stamp component for transferring microstructure

Stamp component for transferring microstructure

Stamp component for transferring microstructure

Surface protective film, making method, and substrate processing laminate

Photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device

Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming process

Silicone structure-containing polymer, photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming process

Photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device

Temporary adhesive film roll for substrate processing, method for manufacturing thin wafer

Chemically amplified positive resist film laminate and pattern forming process

Laminate and making method

Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each having photo-curable resin layer

Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer

Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

Acrylic adhesive sheet

Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device

Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device

Photosensitive resin composition and photosensitive dry film

Epoxy-containing, isocyanurate-modified silicone resin, photosensitive resin composition, photosensitive dry film, laminate, and pattern forming process

Positive resist film laminate and pattern forming process

Silicone skeleton-containing polymer, photo-curable resin composition, photo-curable dry film, laminate, and patterning process

Resin composition, resin film, semiconductor device, and production method thereof

Resin composition, resin film, semiconductor device and method of manufacture thereof

Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device

Flame retardant resin composition, flame retardant resin film, semiconductor device, and making method

Resin composition, resin film, and semiconductor device and method for manufacturing same

SEMILEDS CORP

Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate

Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate

Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate

SUGO MICHIHIRO

Polymer having silphenylene and siloxane structures, a method of preparing the same, an adhesive composition, an adhesive sheet, a protective material for a semiconductor device, and a semiconductor device

Film-like wafer mold material, molded wafer, and semiconductor device

KONDO KAZUNORI

Wheel for vehicle

Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus

TOYOHARA MASAHIRO

High pressure fuel pump control apparatus for internal combustion engine

TAKEUCHI KATSUHIKO

Joint structure of door edge member

FURUYA MASAHIRO

Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition

KURODA YASUYOSHI

Method for manufacturing lamination type semiconductor integrated device

YANAI TOSHIFUMI

Frame molding

3M INNOVATIVE PROPERTIES CO

Oil cleaning sheets for makeup

SHIN ETSU CHEMICALS CO LTD

Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same