USD1070795SActiveUtility

Stamp component for transferring microstructure

44
Assignee: SHINETSU CHEMICAL COPriority: Oct 15, 2021Filed: Apr 15, 2022Granted: Apr 15, 2025
Est. expiryOct 15, 2041(~15.2 yrs left)· nominal 20-yr term from priority
Inventors:Yoshinori OgawaKazunori KondoNobuaki TomuraNobuaki MatsumotoAkira SakamotoTaichi Kitagawa
44
PatentIndex Score
0
Cited by
92
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a stamp component for transferring microstructure, as shown and described.

Join the waitlist — get patent alerts

Track USD1070795S — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.