Inventor
KITAGAWA TAICHI
JP17 patents
⚠️ This page may combine multiple inventors who share the name “KITAGAWA TAICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINETSU CHEMICAL CO
11 patentsUSD1054388SDec 17, 2024
Carrier substrate for handling
SHINETSU CHEMICAL CO7 citations84
US11370869B2Jun 28, 2022
Ultraviolet curable silicone composition for stereolithography and cured product of same
SHINETSU CHEMICAL CO3 citations72
US11827799B2Nov 28, 2023
Ultraviolet curable silicone composition and cured product of same
SHINETSU CHEMICAL CO2 citations71
USD1096678SOct 7, 2025
Stamp component for transferring microstructure
SHINETSU CHEMICAL CO0 citations61
USD1070796SApr 15, 2025
Stamp component for transferring microstructure
SHINETSU CHEMICAL CO0 citations61
USD1070795SApr 15, 2025
Stamp component for transferring microstructure
SHINETSU CHEMICAL CO0 citations61
US12202925B2Jan 21, 2025
Organopolysiloxane, ultraviolet-curable silicone composition and cured product
SHINETSU CHEMICAL CO0 citations61
US12344711B2Jul 1, 2025
UV-curable silicone composition for stereolithography, cured product thereof, and method for producing cured product
SHINETSU CHEMICAL CO0 citations52
US12139571B2Nov 12, 2024
Oxygen-curable silicone composition and cured product thereof
SHINETSU CHEMICAL CO0 citations52
US12180320B2Dec 31, 2024
Ultraviolet curable silicone composition and cured product thereof
SHINETSU CHEMICAL CO0 citations51
US12168745B2Dec 17, 2024
Ultraviolet ray curable silicone adhesive composition and cured product thereof
SHINETSU CHEMICAL CO0 citations51
SEMILEDS CORP
3 patentsUS11417799B2Aug 16, 2022
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate
SEMILEDS CORP4 citations82
US11862755B2Jan 2, 2024
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate
SEMILEDS CORP0 citations61
US11862754B2Jan 2, 2024
Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate
SEMILEDS CORP0 citations61