P

Inventor

YOON JAE-MAN

KR77 patents
⚠️ This page may combine multiple inventors who share the name “YOON JAE-MAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

39 patents
US7382018B2Jun 3, 2008

3-Dimensional flash memory device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD59 citations98
US7368352B2May 6, 2008

Semiconductor devices having transistors with vertical channels and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD61 citations98
US7332386B2Feb 19, 2008

Methods of fabricating fin field transistors

SAMSUNG ELECTRONICS CO LTD56 citations98
US7323375B2Jan 29, 2008

Fin field effect transistor device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD108 citations98
US7160780B2Jan 9, 2007

Method of manufacturing a fin field effect transistor

SAMSUNG ELECTRONICS CO LTD22 citations93
US6570200B1May 27, 2003

Transistor structure using epitaxial layers and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD27 citations93
US7977725B2Jul 12, 2011

Integrated circuit semiconductor device including stacked level transistors

SAMSUNG ELECTRONICS CO LTD20 citations92
US7781287B2Aug 24, 2010

Methods of manufacturing vertical channel semiconductor devices

SAMSUNG ELECTRONICS CO LTD14 citations92
US7781285B2Aug 24, 2010

Semiconductor device having vertical transistor and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD22 citations92
US7586149B2Sep 8, 2009

Circuit device including vertical transistors connected to buried bitlines and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD34 citations92
US7348628B2Mar 25, 2008

Vertical channel semiconductor devices and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD30 citations92
US7279774B2Oct 9, 2007

Bulk substrates in FinFETs with trench insulation surrounding FIN pairs having FINs separated by recess hole shallower than trench

SAMSUNG ELECTRONICS CO LTD26 citations92
US7177192B2Feb 13, 2007

Method of operating a flash memory device

SAMSUNG ELECTRONICS CO LTD37 citations92
US7056781B2Jun 6, 2006

Method of forming fin field effect transistor

SAMSUNG ELECTRONICS CO LTD51 citations92
US7531412B2May 12, 2009

Methods of manufacturing semiconductor memory devices including a vertical channel transistor

SAMSUNG ELECTRONICS CO LTD26 citations91
US7015106B2Mar 21, 2006

Double gate field effect transistor and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD35 citations91
US8373214B2Feb 12, 2013

Semiconductor devices with buried bit lines and methods of manufacturing semiconductor devices

SAMSUNG ELECTRONICS CO LTD7 citations84
US8039896B2Oct 18, 2011

Semiconductor memory device with vertical channel formed on semiconductor pillars

SAMSUNG ELECTRONICS CO LTD8 citations84
US8022457B2Sep 20, 2011

Semiconductor memory device having vertical channel transistor and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD13 citations84
US7902026B2Mar 8, 2011

Method of fabricating semiconductor device having vertical channel transistor

SAMSUNG ELECTRONICS CO LTD12 citations84
US7872302B2Jan 18, 2011

Semiconductor device having vertical transistor formed on an active pattern protruding from a substrate

SAMSUNG ELECTRONICS CO LTD10 citations84
US7759198B2Jul 20, 2010

Method of forming semiconductor devices having a vertical channel transistor

SAMSUNG ELECTRONICS CO LTD8 citations84
US7728373B2Jun 1, 2010

DRAM device with cell epitaxial layers partially overlap buried cell gate electrode

SAMSUNG ELECTRONICS CO LTD13 citations84
US7662720B2Feb 16, 2010

3-Dimensional flash memory device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD8 citations84
US7407845B2Aug 5, 2008

Field effect transistor and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD13 citations84
US7387931B2Jun 17, 2008

Semiconductor memory device with vertical channel transistor and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD12 citations84
US7317646B2Jan 8, 2008

Memory device having shared open bit line sense amplifier architecture

SAMSUNG ELECTRONICS CO LTD15 citations84
US7166514B2Jan 23, 2007

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD15 citations84
US7153733B2Dec 26, 2006

Method of fabricating fin field effect transistor using isotropic etching technique

SAMSUNG ELECTRONICS CO LTD14 citations84
US7592686B2Sep 22, 2009

Semiconductor device having a junction extended by a selective epitaxial growth (SEG) layer and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD13 citations83
US7531874B2May 12, 2009

Field effect transistors including source/drain regions extending beneath pillars

SAMSUNG ELECTRONICS CO LTD9 citations82
US7701002B2Apr 20, 2010

Semiconductor device having buried gate electrode and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD15 citations79
US7999309B2Aug 16, 2011

Semiconductor device

SAMSUNG ELECTRONICS CO LTD6 citations74
US7943978B2May 17, 2011

Semiconductor device

SAMSUNG ELECTRONICS CO LTD5 citations74
US7883972B2Feb 8, 2011

Semiconductor device having a fin structure and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD6 citations74
US7560759B2Jul 14, 2009

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD6 citations74
US7803684B2Sep 28, 2010

Method of fabricating semiconductor device having a junction extended by a selective epitaxial growth (SEG) layer

SAMSUNG ELECTRONICS CO LTD6 citations73
US7288823B2Oct 30, 2007

Double gate field effect transistor and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD7 citations72
US8053307B2Nov 8, 2011

Method of fabricating semiconductor device with cell epitaxial layers partially overlap buried cell gate electrode

SAMSUNG ELECTRONICS CO LTD5 citations63

YOON JAE-MAN

6 patents

SK HYNIX INC

3 patents

KIM BONG-SOO

1 patent

YOON JAE MAN

1 patent

Showing the top 50 of 77 patents by PatentIndex Score.