P

Inventor

SHIMIZU HISASHI

MY57 patents
⚠️ This page may combine multiple inventors who share the name “SHIMIZU HISASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINETSU CHEMICAL CO

23 patents
US5290882AMar 1, 1994

Thermosetting resin compositions

SHINETSU CHEMICAL CO51 citations95
US4678688AJul 7, 1987

Method for forming a surface film of cured organosilicon polymer on a substrate surface

SHINETSU CHEMICAL CO71 citations95
US5298548AMar 29, 1994

Epoxy resin composition and semiconductor devices encapsulated therewith

SHINETSU CHEMICAL CO33 citations93
US4985751AJan 15, 1991

Resin-encapsulated semiconductor devices

SHINETSU CHEMICAL CO32 citations93
US4877822AOct 31, 1989

Epoxy resin composition

SHINETSU CHEMICAL CO42 citations93
US4701482AOct 20, 1987

Epoxy resin composition for encapsulation of semiconductor devices

SHINETSU CHEMICAL CO28 citations93
US6210811B1Apr 3, 2001

Epoxy resin composition, laminate film using the same, and semiconductor device

SHINETSU CHEMICAL CO25 citations92
US8013056B2Sep 6, 2011

White heat-curable silicone resin composition, optoelectronic part case, and molding method

SHINETSU CHEMICAL CO8 citations83
US5182351AJan 26, 1993

Thermosetting resin compositions

SHINETSU CHEMICAL CO20 citations82
US5053445AOct 1, 1991

Epoxy resin composition

SHINETSU CHEMICAL CO12 citations74
US4389432AJun 21, 1983

Method of improving adhesion and adhesion improvers used therefor

SHINETSU CHEMICAL CO16 citations74
US6235865B1May 22, 2001

Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition

SHINETSU CHEMICAL CO14 citations73
US6084037AJul 4, 2000

Epoxy resin composition and semiconductor device

SHINETSU CHEMICAL CO14 citations73
US5340851AAug 23, 1994

Thermosetting resin compositions

SHINETSU CHEMICAL CO15 citations73
US5173544ADec 22, 1992

Epoxy resin compositions

SHINETSU CHEMICAL CO12 citations72
US5300588AApr 5, 1994

Thermosetting resin compositions

SHINETSU CHEMICAL CO15 citations70
US7563854B2Jul 21, 2009

Method of producing high molecular weight organopolysiloxane, composition comprising the high molecular weight organopolysiloxane, and optical semiconductor device sealed with cured product thereof

SHINETSU CHEMICAL CO3 citations63
US7550204B2Jun 23, 2009

Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element

SHINETSU CHEMICAL CO5 citations63
US5643975AJul 1, 1997

Epoxy resin compositions and cured products

SHINETSU CHEMICAL CO6 citations63
US5306748AApr 26, 1994

Fluorine-modified thermosetting resin and thermosetting resin composition

SHINETSU CHEMICAL CO4 citations62
US4331820AMay 25, 1982

Cis-6-undecene-1-chloride and a method for the preparation thereof

SHINETSU CHEMICAL CO2 citations61
US5362887ANov 8, 1994

Fluorine - modified acid anhydrides

SHINETSU CHEMICAL CO1 citations52
US5243058ASep 7, 1993

Allyl or propenyl group-containing naphthalene derivatives

SHINETSU CHEMICAL CO1 citations52

SANYO ELECTRIC CO

8 patents

DAIKIN IND LTD

8 patents

KANTO DENKA KOGYO KK

3 patents

NIPPON TELEGRAPH & TELEPHONE

2 patents

TSUBAKIMOTO CHAIN CO

2 patents

KITZ CORP

2 patents

NISSAN MOTOR

1 patent

TOSHIBA KK

1 patent

Showing the top 50 of 57 patents by PatentIndex Score.