Inventor
HAN CHARLIE
TW21 patents
⚠️ This page may combine multiple inventors who share the name “HAN CHARLIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
19 patentsUS6252300B1Jun 26, 2001
Direct contact through hole type wafer structure
UNITED MICROELECTRONICS CORP128 citations99
US6461956B1Oct 8, 2002
Method of forming package
UNITED MICROELECTRONICS CORP107 citations98
US6323546B2Nov 27, 2001
Direct contact through hole type wafer structure
UNITED MICROELECTRONICS CORP83 citations98
US6429532B1Aug 6, 2002
Pad design
UNITED MICROELECTRONICS CORP92 citations97
US6352923B1Mar 5, 2002
Method of fabricating direct contact through hole type
UNITED MICROELECTRONICS CORP69 citations96
US6214630B1Apr 10, 2001
Wafer level integrated circuit structure and method of manufacturing the same
UNITED MICROELECTRONICS CORP79 citations96
US6399421B2Jun 4, 2002
Dual-dies packaging structure and packaging method
UNITED MICROELECTRONICS CORP18 citations92
US6313527B1Nov 6, 2001
Dual-dies packaging structure and packaging method
UNITED MICROELECTRONICS CORP21 citations92
US6166444ADec 26, 2000
Cascade-type chip module
UNITED MICROELECTRONICS CORP43 citations92
US5995428ANov 30, 1999
Circuit for burn-in operation on a wafer of memory devices
UNITED MICROELECTRONICS CORP26 citations92
US6133629AOct 17, 2000
Multi-chip module package
UNITED MICROELECTRONICS CORP43 citations90
US6545350B2Apr 8, 2003
Integrated circuit packages and the method for the same
UNITED MICROELECTRONICS CORP8 citations73
US5946248AAug 31, 1999
Method for burn-in operation on a wafer of memory devices
UNITED MICROELECTRONICS CORP9 citations73
US5875136AFeb 23, 1999
Repairable memory module and method of repairing memory modules
UNITED MICROELECTRONICS CORP7 citations71
US6279141B1Aug 21, 2001
Preburn-in dynamic random access memory module and preburn-in circuit board thereof
UNITED MICROELECTRONICS CORP9 citations68
US6669520B2Dec 30, 2003
Method of fabricating an LC panel
UNITED MICROELECTRONICS CORP6 citations59
US6820029B2Nov 16, 2004
Method for determining failure rate and selecting best burn-in time
UNITED MICROELECTRONICS CORP6 citations58
US6388460B1May 14, 2002
Alternate timing wafer burn-in method
UNITED MICROELECTRONICS CORP4 citations58
US6846697B2Jan 25, 2005
Integrated circuit packages and the method for making the same
UNITED MICROELECTRONICS CORP0 citations51