Inventor · disambiguated record
Changfeng Xia
Also filed as: XIA CHANGFENG · XIA CHANGFENG F
20 granted patents·5 pending applications·100 citations·filing 1998–2022
93Inventor score
Files withTEXAS INSTRUMENTS INC9CSMC TECHNOLOGIES FAB1 CO LTD5BALL SEMICONDUCTOR INC4CSMC TECHNOLOGIES FAB2 CO LTD4SMC MULTI MEDIA PRODUCTS COMPANY LTD1
Top patents by PatentIndex Score
25 records- 0176US6743719B1Method for forming a conductive copper structureTEXAS INSTRUMENTS INC·Filed 2003·Granted Jun 1, 2004·23 cites·18 claims
- 0274US10077188B2Manufacturing method of MEMS chipCSMC TECHNOLOGIES FAB1 CO LTD·Filed 2017·Granted Sep 18, 2018·1 cites·4 claims
- 0372US12022270B2MEMS microphone and preparation method thereforCSMC TECHNOLOGIES FAB2 CO LTD·Filed 2020·Granted Jun 25, 2024·1 cites·19 claims
- 0468US7550046B2Vapor deposition system using benzotriazole (BTA) and isopropyl alcohol for protecting copper interconnectsTEXAS INSTRUMENTS INC·Filed 2007·Granted Jun 23, 2009·4 cites·7 claims
- 0567US7144802B2Vapor deposition of benzotriazole (BTA) for protecting copper interconnectsTEXAS INSTRUMENTS INC·Filed 2003·Granted Dec 5, 2006·11 cites·13 claims
- 0666US7267726B2Method and apparatus for removing polymer residue from semiconductor wafer edge and back sideTEXAS INSTRUMENTS INC·Filed 2003·Granted Sep 11, 2007·10 cites·17 claims
- 0761US6784093B1Copper surface passivation during semiconductor manufacturingTEXAS INSTRUMENTS INC·Filed 2003·Granted Aug 31, 2004·9 cites·30 claims
- 0854US7067015B2Modified clean chemistry and megasonic nozzle for removing backside CMP slurriesTEXAS INSTRUMENTS INC·Filed 2002·Granted Jun 27, 2006·4 cites·17 claims
- 0953US7195679B2Versatile system for wafer edge remediationTEXAS INSTRUMENTS INC·Filed 2003·Granted Mar 27, 2007·4 cites·29 claims
- 1052US9580301B2MEMS chip and manufacturing method thereforCSMC TECHNOLOGIES FAB1 CO LTD·Filed 2013·Granted Feb 28, 2017·0 cites·3 claims
- 1149US7198705B2Plating-rinse-plating process for fabricating copper interconnectsTEXAS INSTRUMENTS INC·Filed 2002·Granted Apr 3, 2007·2 cites·8 claims
- 1247US6053123APlasma-assisted metallic film depositionBALL SEMICONDUCTOR INC·Filed 1998·Granted Apr 25, 2000·17 cites·19 claims
- 1344US9903884B2Parallel plate capacitor and acceleration sensor comprising sameCSMC TECHNOLOGIES FAB1 CO LTD·Filed 2013·Granted Feb 27, 2018·0 cites·8 claims
- 1444US9006867B2Monitoring structure and monitoring method for silicon wet etching depthCSMC TECHNOLOGIES FAB1 CO LTD·Filed 2012·Granted Apr 14, 2015·0 cites·20 claims
- 1543US11671765B2Micro-Electro-Mechanical System deviceCSMC TECHNOLOGIES FAB2 CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·15 claims
- 1641US12215963B2Galvanometer positioning tool and laser printerSMC MULTI MEDIA PRODUCTS COMPANY LTD·Filed 2022·Granted Feb 4, 2025·0 cites·10 claims
- 1741US2006270233A1Vapor deposition of benzotriazole (BTA) for protecting copper interconnectsXIA CHANGFENG F·Filed 2006·Application pending·0 cites
- 1840US2020216307A1Method for manufacturing dual-cavity structure, and dual-cavity structureCSMC TECHNOLOGIES FAB2 CO LTD·Filed 2018·Application pending·0 cites
- 1940US2015175409A1Method for fabricating multi-trench structureCSMC TECHNOLOGIES FAB1 CO LTD·Filed 2013·Application pending·0 cites
- 2038US2007228010A1Systems and methods for removing/containing wafer edge defects post liner depositionTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 2137US11402952B2Method and circuit for obtaining capacitive feedback signal of capacitive feedback-type micro torsion mirrorXI AN ZHISENSOR TECH CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·14 claims
- 2237US2020243342A1Method of forming cavity based on deep trench erosionCSMC TECHNOLOGIES FAB2 CO LTD·Filed 2018·Application pending·0 cites
- 2333US6221165B1High temperature plasma-assisted diffusionBALL SEMICONDUCTOR INC·Filed 1999·Granted Apr 24, 2001·5 cites·21 claims
- 2433US6015464AFilm growth system and method for spherical-shaped semiconductor integrated circuitsBALL SEMICONDUCTOR INC·Filed 1998·Granted Jan 18, 2000·5 cites·18 claims
- 2532US6303517B1Fast deposition on spherical-shaped integrated circuits in non-contact CVD processBALL SEMICONDUCTOR INC·Filed 1999·Granted Oct 16, 2001·4 cites·34 claims
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