Inventor · disambiguated record
Min Yoo
Also filed as: YOO MIN · YOO MIN KEUN
8 granted patents·2 pending applications·186 citations·filing 2007–2017
87Inventor score
Files withAMKOR TECHNOLOGY INC4DONGWOO FINE CHEM CO LTD2HYUNDAI MOBIS CO LTD1KIM SANG-WON1LEE DONG HEE1
Top patents by PatentIndex Score
10 records- 0196US7843052B1Semiconductor devices and fabrication methods thereofAMKOR TECHNOLOGY INC·Filed 2008·Granted Nov 30, 2010·102 cites·13 claims
- 0294US8294276B1Semiconductor device and fabricating method thereofKIM SANG WON·Filed 2010·Granted Oct 23, 2012·27 cites·18 claims
- 0391US8441123B1Semiconductor device with metal dam and fabricating methodLEE DONG HEE·Filed 2009·Granted May 14, 2013·30 cites·26 claims
- 0480US7718523B1Solder attach film and method of forming solder ball using the sameAMKOR TECHNOLOGY INC·Filed 2007·Granted May 18, 2010·8 cites·7 claims
- 0577US8089148B1Circuit board and semiconductor device having the sameLEE JUN SU·Filed 2009·Granted Jan 3, 2012·12 cites·15 claims
- 0675US8004078B1Adhesive composition for semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2009·Granted Aug 23, 2011·7 cites·20 claims
- 0757US10174231B2Hot-melt adhesive composition, preparation method thereof and vehicle headlampHYUNDAI MOBIS CO LTD·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 0851US7859107B1Solder attach film and assemblyAMKOR TECHNOLOGY INC·Filed 2010·Granted Dec 28, 2010·0 cites·6 claims
- 0936US2016369137A1Adhesive compositionDONGWOO FINE CHEM CO LTD·Filed 2016·Application pending·0 cites
- 1035US2016369135A1Adhesive compositionDONGWOO FINE CHEM CO LTD·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →