Inventor

LEE CHIEN-CHEN

TW43 patents

⚠️ This page may combine multiple inventors who share the name “LEE CHIEN-CHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE CHIEN-CHEN

KINGPAK TECH INC

Chip-scale sensor package structure

Sensor package structure

Sensor lens assembly having non-soldering configuration

Sensor package structure

Sensor package structure

Sensor package structure and sensing module thereof

Sensor package structure

Sensor package structure

Image sensor package with particle blocking dam

Optical sensor

Sensor package structure

Sensor package structure

Sensor lens assembly having non-soldering configuration

Sensor package structure

Sensor package structure

Sensor lens assembly having non-reflow configuration

Sensor lens assembly having non-reflow configuration

Sensor package structure

Sensor lens assembly having non-reflow configuration

Chip-scale sensor package structure

Method for reducing warpage occurred to substrate strip after molding process

Sensor package structure

TONG HSING ELECTRONIC INDUSTRIES LTD

Sensor package structure having solder mask frame

Sensor package structure having solder mask frame

Sensor package structure having ring-shaped solder mask frame

Chip packaging structure and chip packaging method

Sensor package structure

Sensor lens assembly

Sensor package structure

Chip package structure and method for fabricating the same

MCUBE INC

Method and structure of MEMS WLCSP fabrication

Multi-layer single chip MEMS WLCSP fabrication

Method and structure of MEMS PLCSP fabrication

Method and structure of MEMS PLCSP fabrication

STATS CHIPPAC LTD

Semiconductor device and method of forming stress-reduced conductive joint structures

Semiconductor device and method of making wafer level chip scale package

Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate

CHEN JEN YU

Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate

Semiconductor device and method of forming recesses in conductive layer to detect continuity for interconnect between semiconductor die and substrate

AIROHA TECH CORP

Exposed pad module integrating a passive device therein

JCET SEMICONDUCTOR SHAOXING CO LTD

Semiconductor device and method of making wafer level chip scale package

LEE CHIEN CHEN

Semiconductor device and method of reflow soldering for conductive column structure in flip chip package

TONG HSING ELECTRONIC IND LTD

Chip package structure and method for producing the same