Image sensor package with particle blocking dam

Abstract

An image sensor package includes a substrate, a sensor chip, a light-permeable cover, and a particle blocking dam. The substrate has a chip accommodating space, and the sensor chip is disposed in the chip accommodating space and electrically connected to the substrate. The light-permeable cover is disposed on the substrate and disposed above the sensor chip. The particle blocking dam is disposed above the sensor chip and extends from the light-permeable cover toward the sensor chip so as to be in contact with or close to the sensor chip.

What is claimed is: 
     
       1. An image sensor package comprising:
 a substrate having a chip accommodating space; 
 a sensor chip disposed in the chip accommodating space and electrically connected to the substrate, wherein a top surface of the sensor chip includes a sensing region and a pad region peripheral to and spaced apart from the sensing region; 
 a light-permeable cover disposed on the substrate and sealing the chip accommodating space, wherein the light-permeable cover has a light receiving region corresponding to a position of the sensing region; and 
 a particle blocking dam disposed on the light-permeable cover and surrounding the light receiving region, wherein the particle blocking dam extends from the light-permeable cover toward the sensor chip, wherein a bottom end surface of the particle blocking dam is spaced apart from the top surface of the sensor chip by a predetermined distance to define a gap between the particle blocking dam and the sensor chip, and the predetermined distance is less than 5 μm; 
 wherein the particle blocking dam is made of an elastic material, and an orthogonal projection of the particle blocking dam onto the top surface of the sensor chip is located between the sensing region and the pad region. 
 
     
     
       2. The image sensor package according to  claim 1 , wherein a bottom end surface of the particle blocking dam is an arc surface. 
     
     
       3. The image sensor package according to  claim 1 , further comprising: a particle-covering layer located around the sensor chip for transitioning from an initial state to a particle-fixing state for fixing particles. 
     
     
       4. The image sensor package according to  claim 3 , wherein when the particle-covering layer is in the particle-fixing state, the particle-covering layer covers the substrate and connects to a side surface of the sensor chip, and a maximum vertical distance between a top surface of the particle covering layer and a top face of the substrate is less than a thickness of the sensor chip. 
     
     
       5. The image sensor package according to  claim 3 , wherein when the particle-covering layer is in the initial state, the particle-covering layer is disposed on an inner surface of the light-permeable cover and spaced apart from the particle blocking dam. 
     
     
       6. The image sensor package according to  claim 3 , wherein a material of the particle-covering layer is a semi-cured adhesive, and a phase transition temperature of the adhesive is lower than a melting temperature of the particle blocking dam. 
     
     
       7. The image sensor package according to  claim 1 , wherein the sensor chip further includes a plurality of contact pads disposed in the pad region, and the orthogonal projection of the particle blocking dam onto the top surface is located between each of the contact pads and the sensing region;
 wherein the image sensor package further comprises: a plurality of bonding wires respectively connecting the contact pads to the substrate so that the sensor chip is electrically connected to the substrate, and the particle blocking dam is arranged outside of a region spanned by the bonding wires. 
 
     
     
       8. The image sensor package according to  claim 1 , wherein the particle blocking dam is made of a light absorbing material or a material having a low light transmittance. 
     
     
       9. An image sensor package comprising:
 a substrate; 
 a sensor chip disposed on and electrically connected to the substrate; 
 a light-permeable cover disposed on the substrate and disposed above the sensor chip; 
 a particle blocking dam disposed above and around the sensor chip and extending from the light-permeable cover toward the sensor chip; and 
 a particle-covering layer located around the sensor chip for transitioning from an initial state to a particle-fixing state for fixing particles. 
 
     
     
       10. The image sensor package according to  claim 9 , wherein a bottom end surface of the particle blocking dam has different heights relative to an inner surface of the light-permeable cover respectively at different portions, and the particle blocking dam is partially in contact with the top surface of the sensor chip. 
     
     
       11. The image sensor package according to  claim 9 , wherein a bottom end surface of the particle blocking dam is in contact with the top surface of the sensor chip. 
     
     
       12. An image sensor package comprising:
 a substrate; 
 a sensor chip disposed on and electrically connected to the substrate, wherein a top surface of the sensor chip includes a sensing region and a pad region peripheral to and spaced apart from the sensing region, and the sensor chip includes a plurality of contact pads disposed on the top surface and located in the pad region; 
 a light-permeable cover disposed on the substrate and disposed above the sensor chip; 
 a particle blocking dam disposed above and around the sensor chip and extending from the light-permeable cover toward the sensor chip, wherein an orthogonal projection of the particle blocking dam onto the top surface is located between each of the contact pads and the sensing region; and 
 a plurality of bonding wires respectively connecting the contact pads to the substrate so that the sensor chip is electrically connected to the substrate, and the particle blocking dam is arranged outside of a region spanned by the bonding wires.