Inventor · disambiguated record
Chien-Chen Lee
Also filed as: LEE CHIEN · LEE CHIEN C · LEE CHIEN-CHEN
49 granted patents·18 pending applications·142 citations·filing 2004–2023
97Inventor score
Files withKINGPAK TECH INC26TONG HSING ELECTRONIC INDUSTRIES LTD14GENERAL LUMINAIRE SHANGHAI CO LTD5AIROHA TECH CORP4MCUBE INC4
Top patents by PatentIndex Score
67 records- 0197US9349700B2Semiconductor device and method of forming stress-reduced conductive joint structuresSTATS CHIPPAC LTD·Filed 2014·Granted May 24, 2016·63 cites·14 claims
- 0292US12119363B2Sensor package structureKINGPAK TECH INC·Filed 2022·Granted Oct 15, 2024·2 cites·10 claims
- 0392US11967652B2Sensor package structure having solder mask frameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Apr 23, 2024·1 cites·14 claims
- 0491US12108517B2Sensor lens assembly having non-soldering configurationKINGPAK TECH INC·Filed 2022·Granted Oct 1, 2024·2 cites·16 claims
- 0591US12027545B2Sensor package structureKINGPAK TECH INC·Filed 2021·Granted Jul 2, 2024·2 cites·11 claims
- 0690US11683873B1Energy-saving street light system with dynamic and real-time brightness adjustmentGENERAL LUMINAIRE SHANGHAI CO LTD·Filed 2022·Granted Jun 20, 2023·4 cites·6 claims
- 0790US11497095B1LED lighting device capable of adjusting color temperature by hardware and software cooperative control to achieve high-performance light outputGENERAL LUMINAIRE SHANGHAI CO LTD·Filed 2021·Granted Nov 8, 2022·2 cites·7 claims
- 0890US11133348B2Sensor package structure and sensing module thereofKINGPAK TECH INC·Filed 2020·Granted Sep 28, 2021·3 cites·10 claims
- 0990US9673093B2Semiconductor device and method of making wafer level chip scale packageSTATS CHIPPAC LTD·Filed 2014·Granted Jun 6, 2017·9 cites·26 claims
- 1086US11257964B2Sensor package structureKINGPAK TECH INC·Filed 2020·Granted Feb 22, 2022·2 cites·9 claims
- 1184US10106399B1Multi-layer single chip MEMS WLCSP fabricationMCUBE INC·Filed 2017·Granted Oct 23, 2018·3 cites·20 claims
- 1283US11776975B2Sensor package structureKINGPAK TECH INC·Filed 2021·Granted Oct 3, 2023·1 cites·10 claims
- 1381US10868062B2Sensor package structureKINGPAK TECH INC·Filed 2019·Granted Dec 15, 2020·4 cites·7 claims
- 1479US12224359B2Sensor package structure having solder mask frameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Feb 11, 2025·0 cites·11 claims
- 1579US11984516B2Sensor package structure having ring-shaped solder mask frameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted May 14, 2024·0 cites·14 claims
- 1679US11227885B2Image sensor package with particle blocking damKINGPAK TECH INC·Filed 2019·Granted Jan 18, 2022·1 cites·12 claims
- 1779US9224122B2Outdoor device management systemGEN LUMINAIRE CO LTD·Filed 2012·Granted Dec 29, 2015·3 cites·8 claims
- 1878US10721800B1LED light panel capable of adjusting color temperatureGENERAL LUMINAIRE CO LTD·Filed 2019·Granted Jul 21, 2020·3 cites·20 claims
- 1976US11676938B2Semiconductor device and method of making wafer level chip scale packageJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2017·Granted Jun 13, 2023·2 cites·12 claims
- 2074US10964615B2Chip-scale sensor package structureKINGPAK TECH INC·Filed 2019·Granted Mar 30, 2021·2 cites·11 claims
- 2173US9685402B2Semiconductor device and method of forming recesses in conductive layer to detect continuity for interconnect between semiconductor die and substrateCHEN JEN YU·Filed 2011·Granted Jun 20, 2017·5 cites·24 claims
- 2273US8741764B2Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrateCHEN JEN YU·Filed 2011·Granted Jun 3, 2014·5 cites·25 claims
- 2372US9540232B2Method and structure of MEMS WLCSP fabricationMCUBE INC·Filed 2014·Granted Jan 10, 2017·3 cites·14 claims
- 2470US9478513B2Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrateSTATS CHIPPAC LTD·Filed 2014·Granted Oct 25, 2016·3 cites·25 claims
- 2570US2023395624A1Sensor package structure and chip-scale sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 2667US2021305437A1Sensor package structureKINGPAK TECH INC·Filed 2020·Application pending·0 cites
- 2767US2023073527A1Sensor package structure and manufacturing method thereofKINGPAK TECH INC·Filed 2021·Application pending·0 cites
- 2867US2023197743A1Sensor package structureKINGPAK TECH INC·Filed 2022·Application pending·0 cites
- 2966US10825851B2Sensor package structureKINGPAK TECH INC·Filed 2019·Granted Nov 3, 2020·1 cites·7 claims
- 3066US10700111B2Optical sensorKINGPAK TECH INC·Filed 2019·Granted Jun 30, 2020·1 cites·9 claims
- 3166US7015591B2Exposed pad module integrating a passive device thereinAIROHA TECH CORP·Filed 2004·Granted Mar 21, 2006·13 cites·21 claims
- 3261US12177996B2Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Dec 24, 2024·0 cites·10 claims
- 3360US12490541B2Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Dec 2, 2025·0 cites·12 claims
- 3458US12224299B2Sensor package structureKINGPAK TECH INC·Filed 2022·Granted Feb 11, 2025·0 cites·10 claims
- 3558US2024234166A9Chip package structure and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 3657US12356742B2Chip packaging structure and chip packaging methodTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Granted Jul 8, 2025·0 cites·10 claims
- 3757US11900315B2Object storing and finding method and system integrating human sensor into lampGENERAL LUMINAIRE SHANGHAI CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·16 claims
- 3857US2024234457A1Chip package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 3956US12113082B2Sensor package structureKINGPAK TECH INC·Filed 2022·Granted Oct 8, 2024·0 cites·10 claims
- 4055US12189152B2Sensor lens assemblyTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Jan 7, 2025·0 cites·9 claims
- 4154US2024204018A1Chip packaging structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 4253US2024055453A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Application pending·0 cites
- 4352US11792497B2Sensor lens assembly having non-reflow configurationKINGPAK TECH INC·Filed 2022·Granted Oct 17, 2023·0 cites·9 claims
- 4452US11744010B2Sensor lens assembly having non-reflow configurationKINGPAK TECH INC·Filed 2022·Granted Aug 29, 2023·0 cites·10 claims
- 4552US11723147B2Sensor lens assembly having non-reflow configurationKINGPAK TECH INC·Filed 2022·Granted Aug 8, 2023·0 cites·11 claims
- 4652US2010007755A1System and method for executing functions according to captured imagesCHI MEI COMM SYSTEMS INC·Filed 2009·Application pending·0 cites
- 4751US12080659B2Sensor package structureKINGPAK TECH INC·Filed 2022·Granted Sep 3, 2024·0 cites·7 claims
- 4851US9230896B2Semiconductor device and method of reflow soldering for conductive column structure in flip chip packageLEE CHIEN CHEN·Filed 2012·Granted Jan 5, 2016·2 cites·13 claims
- 4950US12376399B2Sensor package structureKINGPAK TECH INC·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 5050US11844162B2Initialization method of human-factor lamps capable of intelligently adjusting ambient lightGENERAL LUMINAIRE SHANGHAI CO LTD·Filed 2022·Granted Dec 12, 2023·0 cites·5 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →