Sensor package structure

Abstract

A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 μm. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

What is claimed is: 
     
         1 . A sensor package structure, comprising:
 a substrate having a first board surface and a second board surface that is opposite to the first board surface;   a sensor chip disposed on the first board surface and electrically coupled to the substrate, wherein a top surface of the sensor chip includes a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 μm;   a ring-shaped solder mask frame disposed on the first board surface of the substrate, wherein the ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip;   a ring-shaped support disposed on a top side of the ring-shaped solder mask frame; and   a light permeable member having a first surface and a second surface that is opposite to the first surface and that is disposed on the ring-shaped support, wherein the second surface of the light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.   
     
     
         2 . The sensor package structure according to  claim 1 , wherein the top side of the ring-shaped solder mask frame is coplanar with the top surface of the sensor chip, the ring-shaped support is arranged outside of the sensing region, and the ring-shaped support is disposed on the top side of the ring-shaped solder mask frame and the top surface of the sensor chip. 
     
     
         3 . The sensor package structure according to  claim 2 , further comprising a plurality of metal wires, wherein the substrate and the sensor chip are electrically coupled to each other through the metal wires, and a part of each of the metal wires is embedded in the ring-shaped support. 
     
     
         4 . The sensor package structure according to  claim 3 , further comprising a package body formed on the first board surface of the substrate, wherein the rest part of each of the metal wires is not embedded in the ring-shaped support but is embedded in the package body, and wherein an outer lateral side of the package body is coplanar with an outer lateral side of the substrate, and is coplanar with an outer lateral surface of the light permeable member. 
     
     
         5 . The sensor package structure according to  claim 1 , wherein the sensor chip includes a plurality of internal contacts arranged on a bottom surface thereof and a plurality of conducting paths that extend from the top surface to the bottom surface, the conducting paths are respectively connected to the internal contacts and are electrically coupled to the sensing region, and the internal contacts are soldered onto the first board surface of the substrate. 
     
     
         6 . The sensor package structure according to  claim 5 , wherein the top side of the ring-shaped solder mask frame is coplanar with the top surface of the sensor chip, and the ring-shaped support is arranged outside of the sensing region and is not in contact with the top surface of the sensor chip. 
     
     
         7 . A sensor package structure, comprising:
 a substrate having a first board surface and a second board surface that is opposite to the first board surface;   a sensor chip disposed on the first board surface and electrically coupled to the substrate, wherein a top surface of the sensor chip includes a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 μm;   a ring-shaped solder mask frame disposed on the first board surface of the substrate, wherein the ring-shaped solder mask frame surrounds and is spaced apart from the outer lateral side of the sensor chip; and   a light permeable member having a first surface and a second surface that is opposite to the first surface and that is disposed on the ring-shaped support, wherein the second surface of the light permeable member, the ring-shaped solder mask frame, and the sensor chip jointly define an enclosed space.   
     
     
         8 . The sensor package structure according to  claim 7 , wherein the ring-shaped solder mask frame is integrally formed as a one-piece structure and has an outer lateral side coplanar with an outer lateral side of the substrate, the second surface of the light permeable member is disposed on an inner lateral side of the ring-shaped solder mask frame, and the first surface of the light permeable member is coplanar with a top side of the ring-shaped solder mask frame. 
     
     
         9 . The sensor package structure according to  claim 7 , wherein the ring-shaped solder mask frame includes a plurality of solder mask layers stacked and adhered together, inner lateral sides of the solder mask layers are not coplanar with each other, and the light permeable member is disposed adjacent to the inner lateral side of one of the solder mask layers. 
     
     
         10 . The sensor package structure according to  claim 9 , further comprising a package body formed on the first board surface of the substrate, wherein outer lateral sides of the solder mask layers are not coplanar with each other, and the package body covers and is adhered to the outer lateral sides of the solder mask layers and at least part of an outer lateral surface of the light permeable member.