Inventor · disambiguated record
Li-Chun Hung
Also filed as: HUNG LI-CHUN
26 granted patents·25 pending applications·23 citations·filing 2017–2025
92Inventor score
Top patents by PatentIndex Score
51 records- 0192US12119363B2Sensor package structureKINGPAK TECH INC·Filed 2022·Granted Oct 15, 2024·2 cites·10 claims
- 0292US11967652B2Sensor package structure having solder mask frameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Apr 23, 2024·1 cites·14 claims
- 0391US12108517B2Sensor lens assembly having non-soldering configurationKINGPAK TECH INC·Filed 2022·Granted Oct 1, 2024·2 cites·16 claims
- 0490US11133348B2Sensor package structure and sensing module thereofKINGPAK TECH INC·Filed 2020·Granted Sep 28, 2021·3 cites·10 claims
- 0586US11257964B2Sensor package structureKINGPAK TECH INC·Filed 2020·Granted Feb 22, 2022·2 cites·9 claims
- 0686US10340250B2Stack type sensor package structureKINGPAK TECH INC·Filed 2018·Granted Jul 2, 2019·6 cites·22 claims
- 0781US2025329678A1Chip structure with conductive pillarTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0879US12224359B2Sensor package structure having solder mask frameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Feb 11, 2025·0 cites·11 claims
- 0979US11984516B2Sensor package structure having ring-shaped solder mask frameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted May 14, 2024·0 cites·14 claims
- 1079US11227885B2Image sensor package with particle blocking damKINGPAK TECH INC·Filed 2019·Granted Jan 18, 2022·1 cites·12 claims
- 1175US12417992B2Chip structure with conductive pillar and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 1274US10964615B2Chip-scale sensor package structureKINGPAK TECH INC·Filed 2019·Granted Mar 30, 2021·2 cites·11 claims
- 1372US10411055B2Sensor package structureKINGPAK TECH INC·Filed 2018·Granted Sep 10, 2019·2 cites·11 claims
- 1470US2023395624A1Sensor package structure and chip-scale sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 1569US11688708B2Chip structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 1667US2021305437A1Sensor package structureKINGPAK TECH INC·Filed 2020·Application pending·0 cites
- 1767US2023197743A1Sensor package structureKINGPAK TECH INC·Filed 2022·Application pending·0 cites
- 1866US10825851B2Sensor package structureKINGPAK TECH INC·Filed 2019·Granted Nov 3, 2020·1 cites·7 claims
- 1966US10700111B2Optical sensorKINGPAK TECH INC·Filed 2019·Granted Jun 30, 2020·1 cites·9 claims
- 2061US12177996B2Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Dec 24, 2024·0 cites·10 claims
- 2161US2025380519A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 2260US12490541B2Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Dec 2, 2025·0 cites·12 claims
- 2360US2025355213A1Sensor lens assembly and housing thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 2458US12224299B2Sensor package structureKINGPAK TECH INC·Filed 2022·Granted Feb 11, 2025·0 cites·10 claims
- 2558US2025120203A1Image sensing moduleTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 2658US2025354862A1Sensor package structure and sensing module thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 2758US2024234166A9Chip package structure and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 2858US2025248150A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 2957US12356742B2Chip packaging structure and chip packaging methodTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Granted Jul 8, 2025·0 cites·10 claims
- 3057US2024234457A1Chip package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 3157US2025185413A1Optical package structure and optical chip thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 3257US2024371820A1Chip package structure and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 3357US2024047491A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 3456US12113082B2Sensor package structureKINGPAK TECH INC·Filed 2022·Granted Oct 8, 2024·0 cites·10 claims
- 3556US2025149348A1Method for reducing warpage occurred to substrate during packaging processTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 3656US2024395950A1Sensor package structure and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 3755US12189152B2Sensor lens assemblyTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Jan 7, 2025·0 cites·9 claims
- 3855US2025040036A1Circuit board structure including metal materials with different thermal expansion coefficients and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 3954US2024188215A1Circuit substrate having improved bonding structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 4054US2024204018A1Chip packaging structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 4153US2024055453A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Application pending·0 cites
- 4252US2025062205A1Shielded through substrate via structures for a silicon interconnect die and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4351US12080659B2Sensor package structureKINGPAK TECH INC·Filed 2022·Granted Sep 3, 2024·0 cites·7 claims
- 4450US12376399B2Sensor package structureKINGPAK TECH INC·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 4550US2025255019A1Sensor package structure having wireless configuration and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 4646US11552120B2Chip-scale sensor package structureKINGPAK TECH INC·Filed 2020·Granted Jan 10, 2023·0 cites·9 claims
- 4746US2024006373A1Package substrate and method for fabricating chip assemblyTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Application pending·0 cites
- 4846US2023360987A1Sensor package structure and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Application pending·0 cites
- 4944US12174446B2Sensor lens assembly having non-soldering configurationKINGPAK TECH INC·Filed 2022·Granted Dec 24, 2024·0 cites·10 claims
- 5043US2021057470A1Sensor package structureKINGPAK TECH INC·Filed 2020·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →