Inventor
ZHOU HOUDE
CN15 patents
Patents
15 patentsUS11133290B2Sep 28, 2021
Chip package structure with stacked chips and manufacturing method thereof
YANGTZE MEMORY TECH CO LTD8 citations82
US11688721B2Jun 27, 2023
Chip package structure and manufacturing method thereof
YANGTZE MEMORY TECH CO LTD1 citations71
US12489066B2Dec 2, 2025
Electromagnetic interference shielding package structures and fabricating methods thereof
YANGTZE MEMORY TECH CO LTD0 citations62
US12557300B2Feb 17, 2026
Memory system packaging structure, and method for forming the same
YANGTZE MEMORY TECH CO LTD0 citations61
US12334361B2Jun 17, 2025
Substrate structure, and fabrication and packaging methods thereof
YANGTZE MEMORY TECH CO LTD0 citations61
US12205940B2Jan 21, 2025
Semiconductor package structure and packaging method thereof
YANGTZE MEMORY TECH CO LTD0 citations61
US12125827B2Oct 22, 2024
Chip package structure and manufacturing method thereof
YANGTZE MEMORY TECH CO LTD0 citations61
US11721686B2Aug 8, 2023
Semiconductor package structure and packaging method thereof
YANGTZE MEMORY TECH CO LTD0 citations61
US11694904B2Jul 4, 2023
Substrate structure, and fabrication and packaging methods thereof
YANGTZE MEMORY TECH CO LTD0 citations61
US11469153B2Oct 11, 2022
Electronic component comprising substrate with thermal indicator
YANGTZE MEMORY TECH CO LTD0 citations61
US12131924B2Oct 29, 2024
Method for processing semiconductor wafers
YANGTZE MEMORY TECH CO LTD0 citations57
US12106985B2Oct 1, 2024
Laser dicing system and method for dicing semiconductor structure including cutting street
YANGTZE MEMORY TECH CO LTD0 citations57
US12166012B2Dec 10, 2024
Flip-chip stacking structures and methods for forming the same
YANGTZE MEMORY TECH CO LTD0 citations51
US11476173B2Oct 18, 2022
Manufacturing method of integrated circuit packaging structure
YANGTZE MEMORY TECH CO LTD0 citations51
US12121995B2Oct 22, 2024
Laser system for dicing semiconductor structure and operation method thereof
YANGTZE MEMORY TECH CO LTD0 citations47