Inventor · disambiguated record
Robert J. Harendza
Also filed as: HARENDZA ROBERT J
2 granted patents·25 citations·filing 2007–2007
60Inventor score
Files withENDICOTT INTERCONNECT TECH INC2
Top patents by PatentIndex Score
2 records- 0187US7596863B2Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities thereinENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Oct 6, 2009·19 cites·10 claims
- 0271US7910156B2Method of making circuitized substrate with selected conductors having solder thereonENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Mar 22, 2011·6 cites·11 claims
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