Inventor
MORROW XIAORONG
US8 patents
⚠️ This page may combine multiple inventors who share the name “MORROW XIAORONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
7 patentsUS6448177B1Sep 10, 2002
Method of making a semiconductor device having a dual damascene interconnect spaced from a support structure
INTEL CORP56 citations95
US7727892B2Jun 1, 2010
Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects
INTEL CORP16 citations92
US7122481B2Oct 17, 2006
Sealing porous dielectrics with silane coupling reagents
INTEL CORP15 citations92
US6661094B2Dec 9, 2003
Semiconductor device having a dual damascene interconnect spaced from a support structure
INTEL CORP25 citations92
US7456490B2Nov 25, 2008
Sealing porous dielectrics with silane coupling reagents
INTEL CORP9 citations83
US7339271B2Mar 4, 2008
Metal-metal oxide etch stop/barrier for integrated circuit interconnects
INTEL CORP9 citations83
US6794755B2Sep 21, 2004
Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement
INTEL CORP11 citations72