Inventor
TAGO MASAMOTO
JP29 patents
⚠️ This page may combine multiple inventors who share the name “TAGO MASAMOTO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
24 patentsUS6844619B2Jan 18, 2005
Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same
NEC CORP151 citations99
US5633204AMay 27, 1997
Method and apparatus for forming bump structure used for flip-chip mounting, the bump structure and the flip-chip
NEC CORP181 citations99
US5508561AApr 16, 1996
Apparatus for forming a double-bump structure used for flip-chip mounting
NEC CORP313 citations99
US7135770B2Nov 14, 2006
Semiconductor element with conductive columnar projection and a semiconductor device with conductive columnar projection
NEC CORP71 citations98
US7449406B2Nov 11, 2008
Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same
NEC CORP34 citations96
US7268438B2Sep 11, 2007
Semiconductor element including a wet prevention film
NEC CORP40 citations96
US6583514B2Jun 24, 2003
Semiconductor device with a binary alloy bonding layer
NEC CORP23 citations93
US6344696B2Feb 5, 2002
Chip size package semiconductor device and method of forming the same
NEC CORP19 citations93
US7793818B2Sep 14, 2010
Semiconductor device, manufacturing method and apparatus for the same
NEC CORP15 citations92
US7749888B2Jul 6, 2010
Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same
NEC CORP17 citations92
US7611041B2Nov 3, 2009
Semiconductor device, manufacturing method and apparatus for the same
NEC CORP19 citations92
US7282432B2Oct 16, 2007
Semiconductor device, manufacturing method and apparatus for the same
NEC CORP16 citations92
US7218005B2May 15, 2007
Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same
NEC CORP25 citations92
US6969915B2Nov 29, 2005
Semiconductor device, manufacturing method and apparatus for the same
NEC CORP26 citations92
US6653731B2Nov 25, 2003
Semiconductor device and method for fabricating same
NEC CORP38 citations92
US7728439B2Jun 1, 2010
Semiconductor device, wiring substrate, and method for manufacturing wiring substrate
NEC CORP8 citations84
US6555416B2Apr 29, 2003
Chip size package semiconductor device and method of forming the same
NEC CORP8 citations74
US7525189B2Apr 28, 2009
Semiconductor device, wiring board, and manufacturing method thereof
NEC CORP2 citations63
US6803253B2Oct 12, 2004
Method for laminating and mounting semiconductor chip
NEC CORP6 citations63
US7297575B2Nov 20, 2007
System semiconductor device and method of manufacturing the same
NEC CORP3 citations62
US7098538B1Aug 29, 2006
System semiconductor device and method of manufacturing the same
NEC CORP4 citations62
US6882542B2Apr 19, 2005
Electronic apparatus
NEC CORP6 citations62
US9125311B2Sep 1, 2015
Hollow sealing structure
NEC CORP0 citations52
US7692287B2Apr 6, 2010
Semiconductor device and wiring board
NEC CORP1 citations52
TAGO MASAMOTO
3 patentsUS8513810B2Aug 20, 2013
Semiconductor device and method of manufacturing same
TAGO MASAMOTO8 citations82
US8916976B2Dec 23, 2014
Semiconductor device and method of manufacturing the same
TAGO MASAMOTO1 citations50
US8791544B2Jul 29, 2014
Semiconductor device, mounted substrate to be used in semiconductor device, and manufacturing method of mounted substrate
TAGO MASAMOTO0 citations40