Inventor · disambiguated record
Chang-Chun Yeh
Also filed as: YEH CHANG-CHUN · YEH CHANG-CHUN ROLAND
9 granted patents·303 citations·filing 2002–2018
89Inventor score
Files withHERMES MICROVISION INC3XIAO HONG2YEH CHANG CHUN2ASML NETHERLANDS BV1HERMES MICROVISION TAIWAN INC1
Top patents by PatentIndex Score
9 records- 0197US8089297B2Structure and method for determining a defect in integrated circuit manufacturing processXIAO HONG·Filed 2008·Granted Jan 3, 2012·92 cites·9 claims
- 0295US7105436B2Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturingHERMES MICROVISION INC·Filed 2004·Granted Sep 12, 2006·84 cites·12 claims
- 0394US6815345B2Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturingHERMES MICROVISION TAIWAN INC·Filed 2002·Granted Nov 9, 2004·101 cites·5 claims
- 0485US10274537B2Test device for defect inspectionHERMES MICROVISION INC·Filed 2016·Granted Apr 30, 2019·4 cites·24 claims
- 0585US8063363B2Method and apparatus for charged particle beam inspectionYEH CHANG CHUN·Filed 2009·Granted Nov 22, 2011·13 cites·36 claims
- 0677US8497475B2Method and apparatus for charged particle beam inspectionYEH CHANG CHUN·Filed 2011·Granted Jul 30, 2013·5 cites·36 claims
- 0773US7474001B2Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturingHERMES MICROVISION INC·Filed 2006·Granted Jan 6, 2009·4 cites·5 claims
- 0853US11443915B2Detection of buried features by backscattered particlesASML NETHERLANDS BV·Filed 2018·Granted Sep 13, 2022·0 cites·17 claims
- 0952US9035674B2Structure and method for determining a defect in integrated circuit manufacturing processXIAO HONG·Filed 2011·Granted May 19, 2015·0 cites·10 claims
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