Inventor · disambiguated record
Benjamin V. Fasano
Also filed as: FASANO BENJAMIN · FASANO BENJAMIN V · FASANO BENJAMIN VITO
82 granted patents·6 pending applications·1,712 citations·filing 1992–2021
99Inventor score
Top patents by PatentIndex Score
88 records- 0197US11075453B1Microelectronics package with ultra-low-K dielectric region between stacked antenna elementsGLOBALFOUNDRIES US INC·Filed 2020·Granted Jul 27, 2021·9 cites·20 claims
- 0297US5791911ACoaxial interconnect devices and methods of making the sameIBM·Filed 1996·Granted Aug 11, 1998·112 cites·2 claims
- 0395US6354844B1Land grid array alignment and engagement designIBM·Filed 1999·Granted Mar 12, 2002·120 cites·19 claims
- 0495US5949030AVias and method for making the same in organic board and chip carriersIBM·Filed 1997·Granted Sep 7, 1999·211 cites·8 claims
- 0594US9607973B1Method for establishing interconnects in packages using thin interposersGLOBALFOUNDRIES INC·Filed 2015·Granted Mar 28, 2017·10 cites·10 claims
- 0694US7518235B2Method and structure to provide balanced mechanical loading of devices in compressively loaded environmentsIBM·Filed 2005·Granted Apr 14, 2009·42 cites·6 claims
- 0793US9360644B2Laser die and photonics die packageIBM·Filed 2014·Granted Jun 7, 2016·14 cites·18 claims
- 0892US10598860B2Photonic die fan out package with edge fiber coupling interface and related methodsGLOBALFOUNDRIES INC·Filed 2018·Granted Mar 24, 2020·10 cites·20 claims
- 0992US9443799B2Interposer with lattice construction and embedded conductive metal structuresIBM·Filed 2014·Granted Sep 13, 2016·9 cites·8 claims
- 1091US7806341B2Structure for implementing secure multichip modules for encryption applicationsIBM·Filed 2009·Granted Oct 5, 2010·16 cites·26 claims
- 1191US7281667B2Method and structure for implementing secure multichip modules for encryption applicationsIBM·Filed 2005·Granted Oct 16, 2007·18 cites·4 claims
- 1291US7250675B2Method and apparatus for forming stacked die and substrate structures for increased packing densityIBM·Filed 2005·Granted Jul 31, 2007·19 cites·9 claims
- 1391US5628849AMethod for in-situ environment sensitive sealing and/or product controllingIBM·Filed 1995·Granted May 13, 1997·31 cites·41 claims
- 1490US11204463B1Integrated circuit structure with optical absorber layer over optical grating couplerGLOBALFOUNDRIES US INC·Filed 2020·Granted Dec 21, 2021·2 cites·20 claims
- 1590US10002835B2Structure for establishing interconnects in packages using thin interposersGLOBALFOUNDRIES INC·Filed 2017·Granted Jun 19, 2018·6 cites·8 claims
- 1690US8290008B2Silicon carrier optoelectronic packagingANDRY PAUL S·Filed 2009·Granted Oct 16, 2012·18 cites·12 claims
- 1790US7611923B2Method and apparatus for forming stacked die and substrate structures for increased packing densityIBM·Filed 2007·Granted Nov 3, 2009·17 cites·9 claims
- 1889US6391669B1Embedded structures to provide electrical testing for via to via and interface layer alignment as well as for conductive interface electrical integrity in multilayer devicesIBM·Filed 2000·Granted May 21, 2002·71 cites·26 claims
- 1989US6224392B1Compliant high-density land grid array (LGA) connector and method of manufactureIBM·Filed 1998·Granted May 1, 2001·57 cites·19 claims
- 2089US6136419ACeramic substrate having a sealed layerIBM·Filed 1999·Granted Oct 24, 2000·74 cites·29 claims
- 2188US9673064B2Interposer with lattice construction and embedded conductive metal structuresIBM·Filed 2015·Granted Jun 6, 2017·4 cites·16 claims
- 2288US7250576B2Chip package having chip extension and methodIBM·Filed 2005·Granted Jul 31, 2007·17 cites·12 claims
- 2388US5755570AApparatus for in situ environment sensitive sealing and/or product controllingIBM·Filed 1995·Granted May 26, 1998·31 cites·44 claims
- 2487US10409014B1PIC die packaging using magnetics to position optical elementGLOBALFOUNDRIES INC·Filed 2018·Granted Sep 10, 2019·6 cites·15 claims
- 2587US6312791B1Multilayer ceramic substrate with anchored padIBM·Filed 2000·Granted Nov 6, 2001·36 cites·19 claims
- 2687US6139666AMethod for producing ceramic surfaces with easily removable contact sheetsIBM·Filed 1999·Granted Oct 31, 2000·88 cites·7 claims
- 2787US6051330ASolid oxide fuel cell having vias and a composite interconnectIBM·Filed 1998·Granted Apr 18, 2000·86 cites·22 claims
- 2886US8559474B2Silicon carrier optoelectronic packagingANDRY PAUL S·Filed 2012·Granted Oct 15, 2013·9 cites·6 claims
- 2985US7472836B2Method and structure for implementing secure multichip modules for encryption applicationsIBM·Filed 2007·Granted Jan 6, 2009·11 cites·5 claims
- 3084US9278401B2Fill head interface with combination vacuum pressure chamberIBM·Filed 2013·Granted Mar 8, 2016·5 cites·16 claims
- 3184US7381590B2Method and device including reworkable alpha particle barrier and corrosion barrierIBM·Filed 2006·Granted Jun 3, 2008·6 cites·15 claims
- 3283US11502400B2Microelectronics package with ultra-low-K dielectric region between stacked antenna elementsGLOBALFOUNDRIES US INC·Filed 2021·Granted Nov 15, 2022·1 cites·20 claims
- 3380US9093563B2Electronic module assembly with patterned adhesive arrayIBM·Filed 2013·Granted Jul 28, 2015·4 cites·21 claims
- 3480US6187418B1Multilayer ceramic substrate with anchored padIBM·Filed 1999·Granted Feb 13, 2001·40 cites·35 claims
- 3576US6051329ASolid oxide fuel cell having a catalytic anodeIBM·Filed 1998·Granted Apr 18, 2000·53 cites·13 claims
- 3675US7781232B2Method to recover underfilled modules by selective removal of discrete componentsIBM·Filed 2008·Granted Aug 24, 2010·6 cites·20 claims
- 3775US7615850B2Method and device including reworkable alpha particle barrier and corrosion barrierIBM·Filed 2008·Granted Nov 10, 2009·2 cites·3 claims
- 3872US11536900B2Integrated circuit structure with optical absorber layer over optical grating couplerGLOBALFOUNDRIES US INC·Filed 2021·Granted Dec 27, 2022·0 cites·20 claims
- 3971US10460956B2Interposer with lattice construction and embedded conductive metal structuresIBM·Filed 2016·Granted Oct 29, 2019·1 cites·17 claims
- 4071US10128590B2Pluggable LGA socket for high density interconnectsIBM·Filed 2015·Granted Nov 13, 2018·2 cites·10 claims
- 4171US6051173AMethod of making a solid oxide fuel cell with controlled porosityIBM·Filed 1998·Granted Apr 18, 2000·46 cites·5 claims
- 4269US5872695AIntegrated electronic components having conductive filled through holesIBM·Filed 1997·Granted Feb 16, 1999·46 cites·4 claims
- 4369US5541145ALow temperature sintering route for aluminum nitride ceramicsCARBORUNDUM CO·Filed 1995·Granted Jul 30, 1996·38 cites·60 claims
- 4467US8981961B2Validation of mechanical connectionsIBM·Filed 2013·Granted Mar 17, 2015·4 cites·13 claims
- 4567US6521355B1Optical color tracer indentifier in metal paste that bleed to greensheetIBM·Filed 2000·Granted Feb 18, 2003·9 cites·15 claims
- 4667US5940966AMethod of making an electronic interconnect deviceIBM·Filed 1997·Granted Aug 24, 1999·21 cites·3 claims
- 4767US5645673ALamination process for producing non-planar substratesIBM·Filed 1995·Granted Jul 8, 1997·31 cites·10 claims
- 4866US6086383ACoaxial interconnect devices and methods of making the sameIBM·Filed 1998·Granted Jul 11, 2000·20 cites·2 claims
- 4964US6436332B1Low loss glass ceramic composition with modifiable dielectric constantIBM·Filed 2000·Granted Aug 20, 2002·5 cites·8 claims
- 5064US6117367APastes for improved substrate dimensional controlIBM·Filed 1998·Granted Sep 12, 2000·22 cites·10 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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