Inventor

LIU PING-YIN

TW100 patents

⚠️ This page may combine multiple inventors who share the name “LIU PING-YIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU PING-YIN

TAIWAN SEMICONDUCTOR MFG CO LTD

Air trench in packages incorporating hybrid bonding

Hybrid bonding systems and methods for semiconductor wafers

Hybrid bonding mechanisms for semiconductor wafers

Methods for hybrid wafer bonding integrated with CMOS processing

Dual facing BSI image sensors with wafer level stacking

Wafer bonding process and structure

Structure and formation method of semiconductor device structure

Alignment systems and wafer bonding systems and methods

Bond chuck, methods of bonding, and tool including bond chuck

Micro electromechanical system sensor and method of forming the same

Method for alignment, process tool and method for wafer-level alignment

3D integrated circuit and methods of forming the same

Integrate rinse module in hybrid bonding platform

Hybrid bonding systems and methods for semiconductor wafers

Air trench in packages incorporating hybrid bonding

Bond chuck, methods of bonding, and tool including bond chuck

Hybrid bonding systems and methods for semiconductor wafers

Apparatus and method for wafer level bonding

Integrate rinse module in hybrid bonding platform

MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portion

Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer

Dual facing BSI image sensors with wafer level stacking

Apparatus for bond wave propagation control

Method for alignment, process tool and method for wafer-level alignment

Methods for hybrid wafer bonding integrated with CMOS processing

Apparatus for bond wave propagation control

Dual facing BSI image sensors with wafer level stacking

Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer

Semiconductor structure and manufacturing method thereof

Wafer bonding process and structure

Method and apparatus for image sensor packaging

3D integrated circuit and methods of forming the same

Apparatus and method for wafer level bonding

Alignment systems and wafer bonding systems and methods

Bond rings in semiconductor devices and methods of forming same

Apparatus and method for cleaning

TAIWAN SEMICONDUCTOR MFG

3D integrated circuit and methods of forming the same

Methods for hybrid wafer bonding

Method and structure for wafer to wafer bonding in semiconductor packaging

Hybrid bonding mechanisms for semiconductor wafers

Hybrid bonding and apparatus for performing the same

Apparatus for vertically integrated backside illuminated image sensors

LIU PING-YIN

Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers

Hybrid bonding systems and methods for semiconductor wafers

MEMS structures and methods for forming the same

Self-removal anti-stiction coating for bonding process

WANG TZU-JUI

Apparatus for vertically integrated backside illuminated image sensors

CHEN SZU-YING

Method and apparatus for image sensor packaging

HUANG HSIN-TING

Method of fabricating a semiconductor device having recessed bonding site

(unassigned)

Electric power recovering system