Inventor
LIN SEAN XUAN
US14 patents
⚠️ This page may combine multiple inventors who share the name “LIN SEAN XUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBALFOUNDRIES INC
13 patentsUS10026687B1Jul 17, 2018
Metal interconnects for super (skip) via integration
GLOBALFOUNDRIES INC20 citations93
US9805972B1Oct 31, 2017
Skip via structures
GLOBALFOUNDRIES INC36 citations93
US9425103B2Aug 23, 2016
Methods of using a metal protection layer to form replacement gate structures for semiconductor devices
GLOBALFOUNDRIES INC7 citations84
US8907483B2Dec 9, 2014
Semiconductor device having a self-forming barrier layer at via bottom
GLOBALFOUNDRIES INC7 citations84
US10395926B1Aug 27, 2019
Multiple patterning with mandrel cuts formed using a block mask
GLOBALFOUNDRIES INC11 citations81
US10134580B1Nov 20, 2018
Metallization levels and methods of making thereof
GLOBALFOUNDRIES INC6 citations73
US10580696B1Mar 3, 2020
Interconnects formed by a metal displacement reaction
GLOBALFOUNDRIES INC3 citations72
US10573593B2Feb 25, 2020
Metal interconnects for super (skip) via integration
GLOBALFOUNDRIES INC3 citations72
US10181421B1Jan 15, 2019
Liner recess for fully aligned via
GLOBALFOUNDRIES INC6 citations72
US9299745B2Mar 29, 2016
Integrated circuits having magnetic tunnel junctions (MTJ) and methods for fabricating the same
GLOBALFOUNDRIES INC5 citations72
USRE49820EJan 30, 2024
Semiconductor device having a self-forming barrier layer at via bottom
GLOBALFOUNDRIES INC0 citations62
USRE47630EOct 1, 2019
Semiconductor device having a self-forming barrier layer at via bottom
GLOBALFOUNDRIES INC0 citations52
US10283372B2May 7, 2019
Interconnects formed by a metal replacement process
GLOBALFOUNDRIES INC0 citations52