Inventor

FURUYAMA HIDETO

JP161 patents

⚠️ This page may combine multiple inventors who share the name “FURUYAMA HIDETO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FURUYAMA HIDETO

TOSHIBA KK

Optical interconnection circuit board and manufacturing method thereof

LSI package equipped with interface module, interface module and connection holding mechanism

LSI package provided with interface module and method of mounting the same

Optical semiconductor module

Optical wiring device

Optical semiconductor module and method for manufacturing the same

Optical data transmission device with parallel channel paths for arrayed optical elements

Semiconductor light detector utilizing an avalanche effect and having an improved guard ring structure

Optical semiconductor module in which a hermetically sealed optical semiconductor device is connected to an electrical wiring layer

Optical interconnection device

Electronic parts mounting apparatus

Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system

Optical fiber connector and connecting method

Holder of optical transmission lines and multi-core optical wave-guide

Interface module-mounted LSI package

Optical interconnection circuit board and manufacturing method thereof

Laser diode assembly

Semiconductor laser device

Bidirectional semiconductor light-emitting element and optical system

Semiconductor light emitting device

Optical semiconductor module and its manufacturing method

Apparatus having optical components and a manufacturing method thereof

Semiconductor light-detection device with recombination rates

Semiconductor light emitting device and light emitting device

Optoelectronic integrated package module and method of manufacturing the same

Photo detector and optically interconnected LSI

Semiconductor light emitting device

Optical multiplexer/demultiplexer

Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system

LSI package provided with interface module, and transmission line header employed in the package

LSI package with interface module and interface module

Laser-induced optical wiring apparatus

Optoelectronic interconnection board, optoelectronic interconnection apparatus, and manufacturing method thereof

Optical connector and process for connecting optical fibers

Optical guide holding member and optical module

LSI package provided with interface module, and transmission line header employed in the package

Interface module for connecting LSI packages, and LSI-incorporating apparatus

Optical interconnection device and method of manufacturing the same

Semiconductor light emitting device and method for manufacturing same

Method of manufacturing a semiconductor light detector

Semiconductor light-emitting device and method of manufacturing the same

Photo detector and optically interconnected LSI

Wiring board and a semiconductor device using the same

LSI apparatus operated by optical clock

Laser-induced optical wiring apparatus

FURUYAMA HIDETO

Optical/electrical composite cable

Semiconductor light emitting device

KABUHSIKI KAISHA TOSHIBA

LSI package provided with interface module

TOSHIBA ELECTRONIC DEVICES & STORAGE CORP

Chip transfer member, chip transfer apparatus, and chip transfer method

UEMURA HIROSHI

Optoelectronic interconnection module