P

Inventor

CHEN MING-HUNG

TW56 patents
⚠️ This page may combine multiple inventors who share the name “CHEN MING-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED SEMICONDUCTOR ENG

20 patents
US10304765B2May 28, 2019

Semiconductor device package

ADVANCED SEMICONDUCTOR ENG37 citations93
US10217649B2Feb 26, 2019

Semiconductor device package having an underfill barrier

ADVANCED SEMICONDUCTOR ENG9 citations80
US10658257B1May 19, 2020

Semiconductor package structure, semiconductor wafer level package and semiconductor manufacturing process

ADVANCED SEMICONDUCTOR ENG2 citations73
US11224132B2Jan 11, 2022

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG2 citations72
US12364008B2Jul 15, 2025

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations63
US12089349B2Sep 10, 2024

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11997888B2May 28, 2024

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations62
US11744024B2Aug 29, 2023

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11437415B2Sep 6, 2022

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11201200B2Dec 14, 2021

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11081473B2Aug 3, 2021

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11942385B2Mar 26, 2024

Semiconductor package structure

ADVANCED SEMICONDUCTOR ENG0 citations61
US11289394B2Mar 29, 2022

Semiconductor package structure

ADVANCED SEMICONDUCTOR ENG0 citations61
US12185475B2Dec 31, 2024

Electronic device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations60
US12300630B2May 13, 2025

Semiconductor device package structure comprising package unit including adhesive layer

ADVANCED SEMICONDUCTOR ENG0 citations59
US11682631B2Jun 20, 2023

Manufacturing process steps of a semiconductor device package

ADVANCED SEMICONDUCTOR ENG0 citations59
US12572170B2Mar 10, 2026

Electronic device with removable electronic component modules

ADVANCED SEMICONDUCTOR ENG0 citations58
US11302647B2Apr 12, 2022

Semiconductor device package including conductive layers as shielding and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations53
US9589871B2Mar 7, 2017

Semiconductor package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations51
US12237272B2Feb 25, 2025

Electronic device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations41

IND TECH RES INST

8 patents

YUMARK ENTPR CORP

4 patents

TREND MICRO INC

2 patents

CAPICOLOR INT COSMETICS LTD

2 patents

CHEN MING-HUNG

2 patents

FALCON IND CO LTD

1 patent

HELIO OPTOELECTRONICS CORP

1 patent

PAN CHING-JEN

1 patent

CHAN CHENG-WEI

1 patent

CHENG WEI-TAI

1 patent

TAIWAN SEMICONDUCTOR MFG CO LTD

1 patent

INNOLUX CORP

1 patent

YOSUN IND CORP

1 patent

YUMARK ENTPR CORPORATION

1 patent

TSENG FAN GANG

1 patent

IBM

1 patent

UNIV MING CHI TECHNOLOGY

1 patent

Showing the top 50 of 56 patents by PatentIndex Score.