Inventor

FOSTER DONALD C

US82 patents

⚠️ This page may combine multiple inventors who share the name “FOSTER DONALD C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FOSTER DONALD C

ZYMOGENETICS INC

Cytokine zalpha11 ligand polynucleotides

Methods of using zalpha11 ligand

Cytokine zalpha11 Ligand

Cytokine zalpha11 ligand

Kunitz domain polypeptide and materials and methods for making it

Glucagon receptor proteins, peptides, and antibodies

Production of activated protein C

Methods for producing hybrid phospholipid-binding proteins

Expression of protein C

Antibodies to human kunitz-type inhibitor

Method for treating inflammation using soluble receptors to interleukin-20

Inhibition of blood coagulation by human-kunitz-type inhibitors

Human amyloid protein precursor homolog and kunitz-type inhibitor

DNA encoding novel human kunitz-type inhibitors and methods relating thereto

Hematopoietic cytokine receptor

Cytokine zalpha11 ligand fusion proteins

Methods for producing thrombin

Hybrid plasminogen activator

Methods for producing thrombin

Methods for producing thrombin

Hybrid protein C

Method for treating inflammation

Soluble Interleukin-20 receptor

Method of detecting glucagon receptor antagonists

Human Kunitz-type inhibitors and compositions thereof

Recombinant production of glucagon receptors

Methods for stimulating granulocyte/macrophage lineage using thrombopoietin

Hematopoietic cytokine receptor

Protese-activated receptor PAR4 (ZCHEMR2)

Methods for producing thrombopoietin polypeptides using a mammalian tissue plasminogen activator secretory peptide

Thrombin-activated tissue plasminogen activators

Methods of using soluble heterodimeric cytokine receptor

Cytokine zalpha11 ligand polynucleotides

Methods of using cytokine zalpha11 ligand

Cytokine zalpha11 ligand fusion proteins

AMKOR TECHNOLOGY INC

Exposed lead QFP package fabricated through the use of a partial saw process

Exposed lead QFP package fabricated through the use of a partial saw process

Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring

Semiconductor package with increased number of input and output pins

Semiconductor package with increased number of input and output pins

Making leadframe semiconductor packages with stacked dies and interconnecting interposer

Making semiconductor devices having stacked dies with biased back surfaces

(unassigned)

Human amyloid protein precursor homologue and Kunitz-type inhibitors

Human amyloid protein precursor homolog and Kunitz-type inhibitor

IBM

Apparatus and method for removing meltable material from a substrate

Method for removing meltable material from a substrate

NOVAK JULIA E

Method of use of cytokine ZALPHA11 ligand

PHARMACEUTICAL PROTEINS LTD

Production of fibrinogen in transgenic animals

NOVO NORDISK AS

Human kunitz-type protease inhibitor and variants thereof

LSI LOGIC CORP

Cavity down plastic ball grid array multi-chip module