Inventor
OKUYAMA TETSUO
JP31 patents
⚠️ This page may combine multiple inventors who share the name “OKUYAMA TETSUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
12 patentsUS5641997AJun 24, 1997
Plastic-encapsulated semiconductor device
TOSHIBA KK442 citations98
US6017386AJan 25, 2000
Decolorizable ink and printer
TOSHIBA KK63 citations96
US5922115AJul 13, 1999
Decolorizable ink and printer
TOSHIBA KK85 citations96
US6054222AApr 25, 2000
Epoxy resin composition, resin-encapsulated semiconductor device using the same, epoxy resin molding material and epoxy resin composite tablet
TOSHIBA KK52 citations94
US6375742B2Apr 23, 2002
Apparatus for processing paper sheets to decolor an image formed thereon
TOSHIBA KK30 citations92
US6228688B1May 8, 2001
Flip-chip resin-encapsulated semiconductor device
TOSHIBA KK41 citations92
US5912320AJun 15, 1999
Polyphenylene sulfide resin composition and resin-encapsulated semiconductor device
TOSHIBA KK20 citations92
US5849651ADec 15, 1998
Reversible thermal recording medium
TOSHIBA KK27 citations92
US4794463ADec 27, 1988
Ink jet system
TOSHIBA KK35 citations92
US6277208B1Aug 21, 2001
Method of decoloring an image forming material formed on a paper sheet
TOSHIBA KK18 citations84
US4833059AMay 23, 1989
Developing method using one-component non-magnetic toner with positive frictional charge
TOSHIBA KK11 citations73
US5328746AJul 12, 1994
Thermal transfer recording medium
TOSHIBA KK5 citations60
TOYO BOSEKI
11 patentsUS11267216B2Mar 8, 2022
Polymer film laminated substrate and method for producing flexible electronic device
TOYO BOSEKI2 citations72
US9895868B2Feb 20, 2018
Method for producing layered product, layered product, method for producing layered product with device using said layered product, and layered product with device
TOYO BOSEKI2 citations68
US12172409B2Dec 24, 2024
Laminate of inorganic substrate/polymer film layer with attached protective film, laminate stack, laminate storage method, and laminate transport method
TOYO BOSEKI0 citations61
US10857762B2Dec 8, 2020
Polymer film coated with a layer of silane coupling agent
TOYO BOSEKI1 citations61
US12115755B2Oct 15, 2024
Laminate of polyimide film and inorganic substrate
TOYO BOSEKI0 citations59
US11065853B2Jul 20, 2021
Polyimide film layered body
TOYO BOSEKI0 citations59
US11833795B2Dec 5, 2023
Multilayer body and method for producing flexible device
TOYO BOSEKI0 citations58
US11655118B2May 23, 2023
Film roll and film bundle
TOYO BOSEKI0 citations58
US12479194B2Nov 25, 2025
Laminate
TOYO BOSEKI0 citations57
US12489044B2Dec 2, 2025
Method for producing layered body, layered body, and multilayered body
TOYO BOSEKI0 citations52
US12391813B2Aug 19, 2025
Layered body including inorganic substrate and polyamic acid cured product
TOYO BOSEKI0 citations47
NIPPEI TOYAMA CORP
3 patentsUS6332834B1Dec 25, 2001
Method and apparatus for grinding a workpiece
NIPPEI TOYAMA CORP18 citations81
US6113489ASep 5, 2000
Ingot slicing method, an ingot manufacturing method and a sliced ingot grinding apparatus
NIPPEI TOYAMA CORP8 citations70
US6722956B2Apr 20, 2004
Working apparatus
NIPPEI TOYAMA CORP9 citations68