Inventor
LEE SHAW WEI
US23 patents
⚠️ This page may combine multiple inventors who share the name “LEE SHAW WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NAT SEMICONDUCTOR CORP
20 patentsUS5652185AJul 29, 1997
Maximized substrate design for grid array based assemblies
NAT SEMICONDUCTOR CORP117 citations98
US5686842ANov 11, 1997
Known good die test apparatus and method
NAT SEMICONDUCTOR CORP75 citations96
US6723585B1Apr 20, 2004
Leadless package
NAT SEMICONDUCTOR CORP111 citations95
US6173490B1Jan 16, 2001
Method for forming a panel of packaged integrated circuits
NAT SEMICONDUCTOR CORP59 citations94
US7087986B1Aug 8, 2006
Solder pad configuration for use in a micro-array integrated circuit package
NAT SEMICONDUCTOR CORP33 citations92
US6362530B1Mar 26, 2002
Manufacturing methods and construction for integrated circuit packages
NAT SEMICONDUCTOR CORP37 citations92
US6284566B1Sep 4, 2001
Chip scale package and method for manufacture thereof
NAT SEMICONDUCTOR CORP20 citations92
US7161232B1Jan 9, 2007
Apparatus and method for miniature semiconductor packages
NAT SEMICONDUCTOR CORP26 citations91
US6054338AApr 25, 2000
Low cost ball grid array device and method of manufacture thereof
NAT SEMICONDUCTOR CORP26 citations91
US5783866AJul 21, 1998
Low cost ball grid array device and method of manufacture thereof
NAT SEMICONDUCTOR CORP32 citations91
US6933212B1Aug 23, 2005
Apparatus and method for dicing semiconductor wafers
NAT SEMICONDUCTOR CORP25 citations90
US6278618B1Aug 21, 2001
Substrate strips for use in integrated circuit packaging
NAT SEMICONDUCTOR CORP21 citations88
US7205095B1Apr 17, 2007
Apparatus and method for packaging image sensing semiconductor chips
NAT SEMICONDUCTOR CORP10 citations84
US6551859B1Apr 22, 2003
Chip scale and land grid array semiconductor packages
NAT SEMICONDUCTOR CORP41 citations84
US7846775B1Dec 7, 2010
Universal lead frame for micro-array packages
NAT SEMICONDUCTOR CORP15 citations83
US7795126B2Sep 14, 2010
Electrical die contact structure and fabrication method
NAT SEMICONDUCTOR CORP12 citations83
US7419855B1Sep 2, 2008
Apparatus and method for miniature semiconductor packages
NAT SEMICONDUCTOR CORP11 citations82
US6396135B1May 28, 2002
Substrate for use in semiconductor packaging
NAT SEMICONDUCTOR CORP16 citations77
US6140708AOct 31, 2000
Chip scale package and method for manufacture thereof
NAT SEMICONDUCTOR CORP13 citations74
US7340181B1Mar 4, 2008
Electrical die contact structure and fabrication method
NAT SEMICONDUCTOR CORP7 citations73