Inventor
TAKEHARA MASATAKA
JP14 patents
⚠️ This page may combine multiple inventors who share the name “TAKEHARA MASATAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
7 patentsUS5606182AFeb 25, 1997
Optical semiconductor device for optical communications with increased positional accuracy of an optical access and method of fabricating the same
MITSUBISHI ELECTRIC CORP36 citations92
US5067005ANov 19, 1991
Semiconductor device
MITSUBISHI ELECTRIC CORP26 citations92
US5025307AJun 18, 1991
Modular semiconductor device
MITSUBISHI ELECTRIC CORP25 citations92
US5500502AMar 19, 1996
Bonding method and apparatus
MITSUBISHI ELECTRIC CORP30 citations90
US5305944AApr 26, 1994
Bonding method and bonding apparatus
MITSUBISHI ELECTRIC CORP31 citations90
US5220196AJun 15, 1993
Semiconductor device
MITSUBISHI ELECTRIC CORP16 citations73
US5105261AApr 14, 1992
Semiconductor device package having particular lead structure for mounting multiple circuit boards
MITSUBISHI ELECTRIC CORP16 citations73
TOWA CORP
6 patentsUS6476507B1Nov 5, 2002
Resin sealing method and resin sealing apparatus
TOWA CORP37 citations92
US6358776B1Mar 19, 2002
Method of fabricating an electronic component and apparatus used therefor
TOWA CORP42 citations92
US7207868B2Apr 24, 2007
Cutting apparatus
TOWA CORP15 citations80
US6736703B2May 18, 2004
Cutting apparatus and cutting method
TOWA CORP8 citations73
US6851355B2Feb 8, 2005
Pressing method, pressing mechanism and resin molding device
TOWA CORP9 citations66
US6712674B2Mar 30, 2004
Polishing apparatus and polishing method
TOWA CORP4 citations62