Modular semiconductor device

Abstract

A modular semiconductor device includes a pair of generally parallel electronic circuit boards and a plurality of IC packages mounted between the electronic circuit boards. Two or more modular semiconductor devices may be stacked on each other so that memory capacity can be readily enlarged and the function level can be readily improved. A heating, radiating fin of planar or honeycomb structure may be provided in near contact with an IC package.

What is claimed is: 
     
       1. A modular semiconductor device comprising: a first pair of generally parallel first electronic circuit boards, each having first and second edges;   at least one integrated circuit disposed generally perpendicular to and mechanically and electrically connected to each of said first pair of first electronic circuit boards; and   first electrical connection means disposed along the first edge of each of said first pair of first electronic circuit boards for establishing electrical connections with external equipment and for supporting said first pair of first electronic circuit boards when connected to external equipment wherein said first electrical connection means comprises a plurality of external electrodes disposed on each of said first electronic circuit boards and a plurality of clip leads, each clip lead including a clip portion contacting one of said external electrodes and engaging one of said electronic circuit boards and a lead portion extending from said clip portion for connection to external equipment, alternating lead portions disposed on each of said first electronic circuit boards being offset from each other.   
     
     
       2. A modular semiconductor device according to claim 1 wherein said first pair of first electronic circuit boards includes second electrical connection means disposed on said second edges of said first pair of first electronic circuit boards for establishing electrical connections with and supporting a second pair of generally parallel second electronic circuit boards having at least one integrated circuit disposed generally perpendicular to said second boards and mechanically and electrically connected to each of them, each second board having at least a first edge. 
     
     
       3. A modular semiconductor device according to claim 2 including a second pair of generally parallel second electronic circuit boards having at least one integrated circuit disposed generally perpendicular to said second boards and mechanically and electrically connected to each of said second boards, each second board having at least a first edge wherein said second electrical connection means comprises a plurality of external electrodes disposed along the second edges of each of said first electronic circuit boards, a plurality of expansion electrodes disposed on the first edges of said second electronic circuit boards, and a plurality of second clip leads, each second clip lead including a lead portion contacting one of said external electrodes of said second electrical connection means disposed along a second edge of one of said first electronic circuit boards and one of said expansion electrodes and a clip portion connected to a lead portion for engaging and supporting one of said first electronic circuit boards. 
     
     
       4. A modular semiconductor device according to claim 3 comprising means for supplying a gas between said first and second pairs of first and second electronic circuit boards to remove heat generated by said integrated circuits. 
     
     
       5. A modular semiconductor device according to claim 4 comprising at least one heat radiating fin disposed along one of at least one of said integrated circuits and having a honeycomb structure having a plurality of through holes extending in the direction of flow of the cooling gas. 
     
     
       6. A modular semiconductor device according to claim 5 wherein at least one of said integrated circuits is a rectangular parallelpiped having two main surfaces and said heat radiating fin is disposed opposite one of said main surfaces of said at least one integrated circuits. 
     
     
       7. A modular semiconductor device according to claim 6 including a cover disposed on said first pair of said first electronic circuit boards to prevent discharge of coolant gas. 
     
     
       8. A modular semiconductor device according to claim 1 comprising at least one heat radiating fin disposed along at least one of said integrated circuits. 
     
     
       9. A modular semiconductor device according to claim 6 comprising at least one heat radiating fin disposed along at least one of said integrated circuits. 
     
     
       10. A modular semiconductor device according to claim 1 wherein at least one of said integrated circuits is a rectangular parallelepiped having two main surfaces and including a heat radiating fin disposed opposite one of said main surfaces of said at least one integrated circuit. 
     
     
       11. A modular semiconductor device according to claim 6 wherein said radiating fin is substantially planar. 
     
     
       12. A modular semiconductor device according to claim 4 wherein said radiating fin is substantially planar.