Inventor

UEDA TETSUYA

JP110 patents

⚠️ This page may combine multiple inventors who share the name “UEDA TETSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UEDA TETSUYA

MITSUBISHI ELECTRIC CORP

Substrateless resin encapsulated semiconductor device

Method of manufacturing semiconductor device

Semiconductor device and module

Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad

Thin semiconductor card

Semiconductor card which can be folded

Semiconductor device

Semiconductor card which can be folded

Tape automated bonding packaged semiconductor device incorporating a heat sink

Semiconductor device

Resin encapsulated semiconductor device with heat radiator

Thin semiconductor card

Semiconductor device

Method of manufacturing a semiconductor device

Semiconductor device having particular power distribution interconnection arrangement

Carrier tape

Carrier tape including molten resin flow path element for resin packaged semiconductor devices

Modular semiconductor device

Tape carrier for tape automated bonding process and a method of producing the same

Mechanism for connecting an IC card to an external device

Mechanism for connecting IC card and external device

Manufacturing method for semiconductor device

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Multi-layer wiring structure having varying-sized cutouts

Microwave plasma film deposition system

Thin layer forming method wherein hydrophobic molecular layers preventing a BPSG layer from absorbing moisture

Semiconductor device having a double-layer interconnection structure

Semiconductor device and its manufacturing method

Semiconductor device with a field-effect transistor having a lower resistance impurity diffusion layer, and method of manufacturing the same

Fuel cell system and operation method having a condensed water tank open to atmosphere

Apparatus for forming hydrogen

Semiconductor device having multilevel interconnection structure and method for fabricating the same

Method of fabricating semiconductor device

Method for fabricating semiconductor device

Semiconductor device and method of fabricating the same

Method for forming a multi-layer metallic wiring structure

Microwave plasma film deposition system

Method of fabricating a semiconductor device including a protective layer

Fuel cell generation system and method

PANASONIC CORP

Semiconductor device with an air gap between lower interconnections and a connection portion to the lower interconnections not formed adjacent to the air gap

Method for fabricating semiconductor device and semiconductor device

Method and fabricating semiconductor device and semiconductor device

Fuel cell cogeneration system, method of operating

MATSUSHITA ELECTRONICS CORP

Semiconductor device and method of fabricating the same

CMOS inverter and standard cell using the same

Semiconductor device having multilevel interconnection structure and method for fabricating the same

UEDA TETSUYA

Three-dimensional metamaterial having function of allowing and inhibiting propagation of electromagnetic waves

Transmission line microwave apparatus including at least one non-reciprocal transmission line part between two parts

Nonreciprocal transmission line apparatus having asymmetric structure of transmission line

NHK SPRING CO LTD

Flexure of hard disk drive

OKA SEIJI

Power semiconductor device