Inventor
PRATT DAVE
US21 patents
⚠️ This page may combine multiple inventors who share the name “PRATT DAVE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
14 patentsUS7821107B2Oct 26, 2010
Die stacking with an annular via having a recessed socket
MICRON TECHNOLOGY INC23 citations92
US7952171B2May 31, 2011
Die stacking with an annular via having a recessed socket
MICRON TECHNOLOGY INC10 citations83
US11328749B2May 10, 2022
Conductive interconnects and methods of forming conductive interconnects
MICRON TECHNOLOGY INC3 citations69
US12438083B2Oct 7, 2025
Assemblies having conductive interconnects which are laterally and vertically offset relative to one another
MICRON TECHNOLOGY INC0 citations61
US12014983B2Jun 18, 2024
Assemblies having conductive interconnects which are laterally and vertically offset relative to one another and methods of forming assemblies having conductive interconnects which are laterally and vertically offset relative to one another
MICRON TECHNOLOGY INC0 citations61
US11482492B2Oct 25, 2022
Assemblies having conductive interconnects which are laterally and vertically offset relative to one another
MICRON TECHNOLOGY INC0 citations61
US11978527B2May 7, 2024
Conductive interconnects and methods of forming conductive interconnects
MICRON TECHNOLOGY INC0 citations59
US12463129B2Nov 4, 2025
Conductive interconnects and methods of forming conductive interconnects
MICRON TECHNOLOGY INC0 citations55
US11545391B2Jan 3, 2023
Conductive interconnects and methods of forming conductive interconnects
MICRON TECHNOLOGY INC0 citations55
US7955946B2Jun 7, 2011
Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices
MICRON TECHNOLOGY INC0 citations51
US10685882B2Jun 16, 2020
Methods of forming through substrate interconnects
MICRON TECHNOLOGY INC0 citations50
US9685375B2Jun 20, 2017
Methods of forming through substrate interconnects
MICRON TECHNOLOGY INC0 citations50
US8927410B2Jan 6, 2015
Methods of forming through substrate interconnects
MICRON TECHNOLOGY INC0 citations50
US8034702B2Oct 11, 2011
Methods of forming through substrate interconnects
MICRON TECHNOLOGY INC0 citations50
PRATT DAVE
5 patentsUS9136259B2Sep 15, 2015
Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking
PRATT DAVE21 citations91
US8546919B2Oct 1, 2013
Die stacking with an annular via having a recessed socket
PRATT DAVE3 citations61
US8227343B2Jul 24, 2012
Die stacking with an annular via having a recessed socket
PRATT DAVE1 citations61
US8531046B2Sep 10, 2013
Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside
PRATT DAVE1 citations51
US8629060B2Jan 14, 2014
Methods of forming through substrate interconnects
PRATT DAVE0 citations49