Inventor

PENG JUNG-HUEI

TW100 patents

⚠️ This page may combine multiple inventors who share the name “PENG JUNG-HUEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PENG JUNG-HUEI

TAIWAN SEMICONDUCTOR MFG CO LTD

MEMS and CMOS integration with low-temperature bonding

Structure and formation method of semiconductor device structure

Multi-pressure MEMS package

Semiconductor device and package and manufacturing method thereof

MEMS devices including MEMS dies and connectors thereto

Semiconductor MEMS structure and manufacturing method thereof

Method to produce chemical pattern in micro-fluidic structure

Getter electrode to improve vacuum level in a microelectromechanical systems (MEMS) device

MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portion

Semiconductor MEMS structure

Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer

MEMS devices including MEMS dies and connectors thereto

MEMS devices including MEMS dies and connectors thereto

Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer

Semiconductor MEMS structure

MEMS device with enhanced sensing structure and manufacturing method thereof

Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ring

Method for manufacturing a microphone

Fluid deposition apparatus and method

Optical device and method of manufacturing the same

Semiconductor MEMS structure

Structure for integrated microphone

Semiconductor structure for MEMS device

CMOS-MEMS structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG

Method and structure for wafer to wafer bonding in semiconductor packaging

Triple-axis MEMS accelerometer

MEMS devices and methods of forming the same

MEMS device and method of forming the same

MEMS device and method of forming the same

MEMS devices and methods for forming same

Method to produce chemical pattern in micro-fluidic structure

Semiconductor device

Systems and methods for post-bonding wafer edge seal

Method of making flowcell with micro-fluid structure

Method for reducing chip warpage

Package systems

Cap and substrate electrical connection at wafer level

Semiconductor device with through molding vias

Package systems and manufacturing methods thereof

Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structures

Multi-step process for forming high-aspect-ratio holes for MEMS devices

ILLUMINA INC

Method to produce chemical pattern in micro-fluidic structure

Method to produce chemical pattern in micro-fluidic structure

LIU PING-YIN

MEMS structures and methods for forming the same

Self-removal anti-stiction coating for bonding process

PENG JUNG-HUEI

MEMS devices and methods of fabrication thereof

LIU MARTIN

Wafer level packaging bond

WU TING-HAU

Method for reducing chip warpage

HUANG HSIN-TING

Method of fabricating a semiconductor device having recessed bonding site

CHU CHIA-HUA

Package systems having a conductive element through a substrate thereof and manufacturing methods of the same