Inventor

CHANG KUEI-SUNG

TW90 patents

⚠️ This page may combine multiple inventors who share the name “CHANG KUEI-SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG KUEI-SUNG

TAIWAN SEMICONDUCTOR MFG CO LTD

Multi-pressure MEMS package

Integrated semiconductor device and wafer level method of fabricating the same

Wafer level method of sealing different pressure levels for MEMS sensors

Package structure including a base and a lid disposed over the base and method of forming the package structure

Package structure and measurement method for the package structure

Method of making ohmic contact on low doped bulk silicon for optical alignment

Method of stiction prevention by patterned anti-stiction layer

Multi-pressure MEMS package

Magnetic sensor and forming method

Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop

Wafer level sealing methods with different vacuum levels for MEMS sensors

Microelectromechanical system device and method for manufacturing the same

Semiconductor devices and methods of manufacture thereof

Micro-electro mechanical system device containing a bump stopper and methods for forming the same

Package structure having a device inside a molding member and method of forming the package structure

Package structure and measurement method for the package structure

MEMS device with dummy-area utilization for pressure enhancement

Semiconductive structure and manufacturing method thereof

Method of making ohmic contact on low doped bulk silicon for optical alignment

Method of making ohmic contact on low doped bulk silicon for optical alignment

MEMS device with dummy-area utilization for pressure enhancement

Semiconductor structure and manufacturing method thereof

MEMS structure and method of forming same

Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop

Stopper bump structures for MEMS device

Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure

Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure

MEMS structure and method of forming same

Semiconductor structure and manufacturing method thereof

MEMS apparatus with anti-stiction layer

Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure

Narrow gap device with parallel releasing structure

Narrow gap device with parallel releasing structure

MEMS method and structure

Die attached leveling control by metal stopper bumps

TAIWAN SEMICONDUCTOR MFG

MEMS device and method of forming the same

MEMS device and method of forming the same

Integrated semiconductor device and wafer level method of fabricating the same

Integrated semiconductor device and wafer level method of fabricating the same

Semiconductor bonding structure and process

Package systems

Package systems and manufacturing methods thereof

MEMS device etch stop

MEMS device etch stop

TSAI YI HENG

Support structure for TSV in MEMS structure

MEMS structure and method of forming same

CHU CHIA-HUA

Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the same

Package systems having a conductive element through a substrate thereof and manufacturing methods of the same

HUNG CHIA-MING

Electrical bypass structure for MEMS device

SHU CHIA-PAO

Package systems having a eutectic bonding material and manufacturing methods thereof