Inventor
PAITAL SAMEER
US13 patents
Patents
13 patentsUS11443885B2Sep 13, 2022
Thin film barrier seed metallization in magnetic-plugged through hole inductor
INTEL CORP4 citations72
US11322444B2May 3, 2022
Lithographic cavity formation to enable EMIB bump pitch scaling
INTEL CORP1 citations72
US12230430B2Feb 18, 2025
Substrate embedded magnetic core inductors and method of making
INTEL CORP0 citations62
US11929212B2Mar 12, 2024
Method to form high capacitance thin film capacitors (TFCs) as embedded passives in organic substrate packages
INTEL CORP0 citations62
US11348718B2May 31, 2022
Substrate embedded magnetic core inductors and method of making
INTEL CORP0 citations62
US11227849B2Jan 18, 2022
Electroless-catalyst doped-mold materials for integrated-circuit die packaging architectures
INTEL CORP0 citations62
US12568831B2Mar 3, 2026
Patternable die attach materials and processes for patterning
INTEL CORP0 citations61
US12354963B2Jul 8, 2025
Lithographic cavity formation to enable EMIB bump pitch scaling
INTEL CORP0 citations61
US12334443B2Jun 17, 2025
Lithographic cavity formation to enable EMIB bump pitch scaling
INTEL CORP0 citations61
US11929330B2Mar 12, 2024
Lithographic cavity formation to enable EMIB bump pitch scaling
INTEL CORP0 citations61
US11923312B2Mar 5, 2024
Patternable die attach materials and processes for patterning
INTEL CORP0 citations61
US12517314B2Jan 6, 2026
High bandwidth optical interconnection architectures
INTEL CORP0 citations50
US11728265B2Aug 15, 2023
Selective deposition of embedded thin-film resistors for semiconductor packaging
INTEL CORP0 citations48