Lithographic cavity formation to enable EMIB bump pitch scaling

Abstract

Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.

What is claimed is: 
     
       1. An electronic package, comprising:
 a first layer, wherein the first layer comprises an organic material; 
 a second layer disposed over the first layer, wherein the second layer comprises an organic material; 
 a cavity through the second layer to expose a first surface of the first layer; and 
 a bridge substrate in the cavity, wherein the bridge substrate is supported by and in contact with the first surface of the first layer, and wherein the bridge substrate is laterally spaced apart from the second layer. 
 
     
     
       2. The electronic package of  claim 1 , wherein the cavity includes a first portion and a second portion above the first portion, wherein a width of the first portion is greater than a width of the second portion. 
     
     
       3. The electronic package of  claim 2 , wherein a height of the first portion of the cavity is equal to a height of a first conductive layer over the first layer. 
     
     
       4. The electronic package of  claim 3 , wherein a height of the second portion of the cavity is equal to a height of a pillar over the first conductive layer. 
     
     
       5. The electronic package of  claim 2 , wherein a sidewall surface of the first portion of the cavity and a sidewall surface of the second portion of the cavity are substantially vertical. 
     
     
       6. The electronic package of  claim 1 , further comprising:
 a third layer, wherein the third layer fills the cavity and is over the second layer. 
 
     
     
       7. The electronic package of  claim 6 , wherein the third layer conforms to sidewall surfaces of the cavity. 
     
     
       8. The electronic package of  claim 7 , further comprising:
 a conductive layer over the third layer, wherein the conductive layer is electrically coupled to a contact pad on the bridge substrate with a via through a portion of the third layer. 
 
     
     
       9. The electronic package of  claim 1 , wherein a top surface of the second layer is above a top surface of the bridge substrate. 
     
     
       10. An electronic package, comprising:
 a first layer, wherein the first layer comprises an organic material; 
 a second layer disposed over the first layer, wherein the second layer comprises an organic material; 
 a cavity through the second layer to expose a first surface of the first layer, wherein the cavity includes a first portion and a second portion above the first portion, wherein a width of the first portion is greater than a width of the second portion; and 
 a bridge substrate in the cavity, wherein the bridge substrate is supported by the first surface of the first layer. 
 
     
     
       11. The electronic package of  claim 10 , wherein a height of the first portion of the cavity is equal to a height of a first conductive layer over the first layer. 
     
     
       12. The electronic package of  claim 11 , wherein a height of the second portion of the cavity is equal to a height of a pillar over the first conductive layer. 
     
     
       13. The electronic package of  claim 10 , wherein a sidewall surface of the first portion of the cavity and a sidewall surface of the second portion of the cavity are substantially vertical. 
     
     
       14. An electronic package, comprising:
 a first layer, wherein the first layer comprises an organic material; 
 a second layer disposed over the first layer, wherein the second layer comprises an organic material; 
 a cavity through the second layer to expose a first surface of the first layer; 
 a bridge substrate in the cavity, wherein the bridge substrate is supported by the first surface of the first layer; and 
 a third layer, wherein the third layer fills the cavity and is over the second layer. 
 
     
     
       15. The electronic package of  claim 14 , wherein the third layer conforms to sidewall surfaces of the cavity. 
     
     
       16. The electronic package of  claim 14 , further comprising:
 a conductive layer over the third layer, wherein the conductive layer is electrically coupled to a contact pad on the bridge substrate with a via through a portion of the third layer.