Inventor

NIE BAI

US20 patents

⚠️ This page may combine multiple inventors who share the name “NIE BAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NIE BAI

INTEL CORP

Microelectronic structures including bridges

Substrate with variable height conductive and dielectric elements

Lithographic cavity formation to enable EMIB bump pitch scaling

Photonic interconnect and components in glass

Nested glass packaging architecture for hybrid electrical and optical communication devices

Patternable die attach materials and processes for patterning

Methods and apparatus to increase glass core thickness

Lithographic cavity formation to enable EMIB bump pitch scaling

Die last and waveguide last architecture for silicon photonic packaging

Lithographic cavity formation to enable EMIB bump pitch scaling

Lithographic cavity formation to enable EMIB bump pitch scaling

Patternable die attach materials and processes for patterning

Hybrid fine line spacing architecture for bump pitch scaling

Photonic integrated circuit packaging architectures

Electronic packaging architecture with customized variable metal thickness on same buildup layer

Omni directional interconnect with magnetic fillers in mold matrix

Die first fan-out architecture for electric and optical integration

High bandwidth optical interconnection architectures

Microelectronic structures including bridges

DANTUS MARCOS

Ultrafast laser apparatus