Inventor
TAN CHUNG KWANG CHRISTOPHER
US10 patents
Patents
10 patentsUS11322444B2May 3, 2022
Lithographic cavity formation to enable EMIB bump pitch scaling
INTEL CORP1 citations72
US11676891B2Jun 13, 2023
Method to enable 30 microns pitch EMIB or below
INTEL CORP2 citations70
US11088062B2Aug 10, 2021
Method to enable 30 microns pitch EMIB or below
INTEL CORP4 citations70
US12176223B2Dec 24, 2024
Integrated circuit package supports
INTEL CORP0 citations62
US11854834B2Dec 26, 2023
Integrated circuit package supports
INTEL CORP0 citations62
US11309192B2Apr 19, 2022
Integrated circuit package supports
INTEL CORP0 citations62
US12354963B2Jul 8, 2025
Lithographic cavity formation to enable EMIB bump pitch scaling
INTEL CORP0 citations61
US12334443B2Jun 17, 2025
Lithographic cavity formation to enable EMIB bump pitch scaling
INTEL CORP0 citations61
US11929330B2Mar 12, 2024
Lithographic cavity formation to enable EMIB bump pitch scaling
INTEL CORP0 citations61
US12230563B2Feb 18, 2025
Method to enable 30 microns pitch EMIB or below
INTEL CORP0 citations59