Inventor

PARK YISU

KR6 patents

⚠️ This page may combine multiple inventors who share the name “PARK YISU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC PTE LTD

2 patents

US10700011B2Jun 30, 2020

Semiconductor device and method of forming an integrated SIP module with embedded inductor or package

STATS CHIPPAC PTE LTD7 citations83

US11367690B2Jun 21, 2022

Semiconductor device and method of forming an integrated SiP module with embedded inductor or package

STATS CHIPPAC PTE LTD0 citations61

PARK YISU

1 patent

US8723310B2May 13, 2014

Integrated circuit packaging system having warpage prevention structures

PARK YISU8 citations77

LEE KYUNGHOON

1 patent

US9390945B2Jul 12, 2016

Semiconductor device and method of depositing underfill material with uniform flow rate

LEE KYUNGHOON4 citations71

CHOI DAESIK

1 patent

US9406579B2Aug 2, 2016

Semiconductor device and method of controlling warpage in semiconductor package

CHOI DAESIK5 citations70

KIM MINJUNG

1 patent

US8703535B2Apr 22, 2014

Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereof

KIM MINJUNG4 citations70