Inventor

LEE HUNTEAK

KR45 patents

⚠️ This page may combine multiple inventors who share the name “LEE HUNTEAK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE HUNTEAK

STATS CHIPPAC PTE LTD

Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same

Molded laser package with electromagnetic interference shield and method of making

Semiconductor device and method of forming a 3D interposer system-in-package module

Semiconductor device and method of forming a 3D integrated system-in-package module

Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same

Semiconductor device and method of forming a 3D interposer system-in-package module

Semiconductor device and method of forming an integrated SIP module with embedded inductor or package

Selective EMI shielding using preformed mask

Selective EMI shielding using preformed mask

Double-sided partial molded SIP module

Semiconductor device and method of forming protrusion E-bar for 3D SIP

Semiconductor manufacturing device and method of enhancing mold gate injector and air vent to reduce voids in encapsulant

Antenna-in-package devices and methods of making

Method and device for reducing metal burrs when sawing semiconductor packages

Semiconductor device and method of forming a 3D interposer system-in-package module

Method and device for reducing metal burrs when sawing semiconductor packages

Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same

Method and device for reducing metal burrs when sawing semiconductor packages

Molded laser package with electromagnetic interference shield and method of making

Molded laser package with electromagnetic interference shield and method of making

Semiconductor device and method of forming an integrated SiP module with embedded inductor or package

Semiconductor device and method of forming SIP module over film layer

Method of forming SIP module over film layer

Cooling device and process for cooling double-sided SiP devices during sputtering

Double-sided partial molded SiP module

Semiconductor device and method of forming discrete antenna modules

Cooling device and process for cooling double-sided SiP devices during sputtering

Semiconductor device and method of forming discrete antenna modules

Cooling device and process for cooling double-sided SiP devices during sputtering

Semiconductor device and method of forming protrusion e-bar for 3D SiP

Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation

Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation

Semiconductor device and method of forming a 3D integrated system-in-package module

Semiconductor manufacturing equipment and method of providing support base with filling material disposed into openings in semiconductor wafer for support

STATS CHIPPAC LTD

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form

Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding

Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe

Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form

Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates

Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding

PAGAILA REZA A

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe

YUN JAEUN

Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue

LEE HUNTEAK

Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape