Inventor

CHO EUNG SAN

US105 patents

⚠️ This page may combine multiple inventors who share the name “CHO EUNG SAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHO EUNG SAN

INFINEON TECHNOLOGIES AMERICAS CORP

Power converter package with an integrated output inductor

Power semiconductor package having power semiconductor die in a support substrate with bar vias

Stacked half-bridge package

Semiconductor package including flip chip mounted IC and vertically integrated inductor

Breakable substrate for semiconductor die

Multi-phase common contact package

Powerstage attached to inductor

Compact high-voltage semiconductor package

Power switch packaging with pre-formed electrical connections for connecting inductor to one or more transistors

Single-sided power device package

Compact multi-die power semiconductor package

Array based fabrication of power semiconductor package with integrated heat spreader

Power semiconductor package with integrated heat spreader and partially etched conductive carrier

Semiconductor package with integrated output inductor on a printed circuit board

Power converter package with integrated output inductor

Semiconductor package with embedded output inductor

Semiconductor package with via-coupled power transistors

CHO EUNG SAN

High power semiconductor package with multiple conductive clips

High power semiconductor package with conductive clips and flip chip driver IC

High power semiconductor package with conductive clip on multiple transistors

Direct contact leadless flip chip package for high current devices

Stacked half-bridge package with a common conductive leadframe

High power semiconductor package with conductive clip and flip chip driver IC with integrated control transistor

Stacked half-bridge package with a current carrying layer

Common drain exposed conductive clip for high power semiconductor packages

Thermally enhanced semiconductor package with exposed parallel conductive clip

Direct contact leadless package

Stacked half-bridge package with a common conductive clip

Direct contact flip chip package with power transistors

Direct contact semiconductor package with power transistor

INT RECTIFIER CORP

Multi-transistor exposed conductive clip for high power semiconductor packages

Semiconductor package including a power stage and integrated output inductor

Stacked half-bridge package with a common leadframe

Power converter package including vertically stacked driver IC

Semiconductor package with multiple conductive clips

Method for fabricating a semiconductor package with conductive carrier integrated heat spreader

Power semiconductor package with non-contiguous, multi-section conductive carrier

Power semiconductor package with multi-section conductive carrier

Thermally enhanced semiconductor package with conductive clip

Direct contact package for power transistors

INFINEON TECHNOLOGIES AG

Antenna apparatus and fabrication method

Power stage device with carrier frame for power stage module and integrated inductor

Space efficient and low parasitic half bridge

Antenna package with via structure and method of formation thereof

Antenna apparatus and fabrication method

Embedded package with electrically isolating dielectric liner

Embedded package with electrically isolating dielectric liner

Antenna package with via structure and method of formation thereof

Antenna package and method of formation thereof

INFINEON TECHNOLOGIES AUSTRIA AG

Semiconductor package and method of fabricating a semiconductor package