Antenna apparatus and fabrication method

Abstract

A semiconductor device includes a semiconductor die comprising a radio frequency (RF) circuit, a first dielectric layer disposed over a first surface of the semiconductor die, an antenna layer disposed over a surface of the first dielectric layer, and an antenna feeding structure coupling the antenna layer to the RF circuit of the semiconductor die, wherein the semiconductor die comprises a via, and the antenna feeding structure comprises a first portion arranged within the opening of the semiconductor die and extending to the first surface of the semiconductor die, and a second portion arranged through the first dielectric layer.

What is claimed is: 
     
       1. A method for fabricating an antenna-in-package (AiP) device comprising:
 forming a via, by a via formation process, in a semiconductor die comprising a radio frequency (RF) circuit; 
 depositing a first dielectric layer over a first surface of the semiconductor die by a deposition process; 
 forming a first via in the first dielectric layer; and 
 forming an antenna layer on a first surface of the first dielectric layer, wherein an antenna feeding structure is configured to couple the RF circuit to the antenna layer, and wherein the antenna feeding structure comprises a first portion formed by the via of the semiconductor die and extending to the first surface of the semiconductor die, and a second portion formed by the first via. 
 
     
     
       2. The method for fabricating the AiP device of  claim 1 , further comprising:
 forming a first opening in the first dielectric layer; 
 filling the first opening to form the first via, and forming the antenna layer over the first surface of the first dielectric layer with a conductive material, wherein the antenna layer is electrically coupled to the RF circuit of the semiconductor die through the antenna feeding structure; 
 forming a second opening in the first dielectric layer, wherein the second opening and the first opening are on opposite sides of the semiconductor die; 
 filling the second opening to form a second via, and forming a redistribution layer over a second surface of the first dielectric layer with the conductive material; 
 depositing a second dielectric layer over the first surface of the first dielectric layer, wherein the antenna layer is embedded in the second dielectric layer; and 
 depositing a third dielectric layer over the second surface of the first dielectric layer, wherein the redistribution layer is embedded in the third dielectric layer. 
 
     
     
       3. The method for fabricating the AiP device of  claim 2 , further comprising:
 forming a first seed layer on the first surface of the first dielectric layer prior to forming the first opening in the first dielectric layer; and 
 forming a second seed layer on the second surface of the first dielectric layer prior to forming the second opening in the first dielectric layer. 
 
     
     
       4. The method for fabricating the AiP device of  claim 3 , further comprising:
 depositing a first photoresist layer over the first seed layer, wherein the first photoresist layer is of a first predetermined pattern; 
 plating the conductive material over exposed portions of the first seed layer to form the antenna layer; 
 removing the first photoresist layer to expose the first seed layer under the first photoresist layer; and 
 after removing the first photoresist layer, applying a first etching process to remove the exposed portions of the first seed layer. 
 
     
     
       5. The method for fabricating the AiP device of  claim 3 , further comprising:
 depositing a second photoresist layer over the second seed layer, wherein the second photoresist layer is of a second predetermined pattern; 
 plating the conductive material over exposed portions of the second seed layer to form the redistribution layer; 
 removing the second photoresist layer to expose the second seed layer under the second photoresist layer; and 
 after removing the second photoresist layer, applying a second etching process to remove the exposed portions of the second seed layer. 
 
     
     
       6. The method for fabricating the AiP device of  claim 3 , further comprising:
 attaching a plurality of input/output connectors to the redistribution layer, wherein the plurality of input/output connectors and the antenna layer are on the opposite sides of the semiconductor die. 
 
     
     
       7. The method for fabricating the AiP device of  claim 6 , wherein:
 at least one input/output connector of the plurality of input/output connectors is directly underneath the semiconductor die. 
 
     
     
       8. An antenna-in-package (AiP) device comprising:
 a semiconductor die comprising a via formed by a via formation process and a radio frequency (RF) circuit; 
 a first dielectric layer disposed over a first surface of the semiconductor die; 
 an antenna layer disposed over a surface of the first dielectric layer formed by a deposition process; and 
 an antenna feeding structure comprising a first portion formed by the via of the semiconductor die, and a second portion within the first dielectric layer, wherein the antenna layer is coupled to the RF circuit of the semiconductor die through the antenna feeding structure. 
 
     
     
       9. The AiP device of  claim 8 , wherein:
 the antenna feeding structure further comprises a conductive feature extending on the first surface of the semiconductor die, and wherein the conductive feature is coupled between the first portion of the antenna feeding structure and the second portion of the antenna feeding structure. 
 
     
     
       10. The AiP device of  claim 8 , further comprising:
 a redistribution structure comprising a redistribution layer and a second dielectric layer, and wherein the redistribution structure is over a second surface of the semiconductor die, and the redistribution layer is embedded in the second dielectric layer; and 
 a plurality of input/output pads electrically coupled to the semiconductor die through the redistribution structure. 
 
     
     
       11. The AiP device of  claim 8 , wherein:
 the second portion of the antenna feeding structure is a first via formed in the first dielectric layer, and wherein the first via is in direct contact with the via of the semiconductor die. 
 
     
     
       12. The AiP device of  claim 11 , wherein:
 a width of the via of the semiconductor die is equal to a width of the first via. 
 
     
     
       13. A method for fabricating an antenna-in-package (AiP) device comprising:
 providing a semiconductor die comprising a first circuit, and a first via extending from a first surface of the semiconductor die to a second surface of the semiconductor die opposite the first surface, 
 depositing a first dielectric layer over a first surface of the semiconductor die by a deposition process, and 
 forming a second via in the first dielectric layer by a via formation process; and 
 forming an antenna layer on a first surface of the first dielectric layer, wherein the first via and the second via are configured to form at least a portion of path operatively coupling the first circuit to the antenna layer. 
 
     
     
       14. The method for fabricating the AiP device of  claim 13 , further comprising:
 forming a first opening in the first dielectric layer; 
 filling the first opening to form the second via, and forming the antenna layer over the first surface of the first dielectric layer with a conductive material; 
 forming a second opening in the first dielectric layer, wherein the second opening and the first opening are on opposite sides of the semiconductor die; 
 filling the second opening to form a third via, and forming a redistribution layer over a second surface of the first dielectric layer with the conductive material; 
 depositing a second dielectric layer over the first surface of the first dielectric layer, wherein the antenna layer is embedded in the second dielectric layer; and 
 depositing a third dielectric layer over the second surface of the first dielectric layer, wherein the redistribution layer is embedded in the third dielectric layer. 
 
     
     
       15. The method for fabricating the AiP device of  claim 14 , further comprising:
 forming a first seed layer on the first surface of the first dielectric layer prior to forming the first opening in the first dielectric layer; and 
 forming a second seed layer on the second surface of the first dielectric layer prior to forming the second opening in the first dielectric layer. 
 
     
     
       16. The method for fabricating the AiP device of  claim 15 , further comprising:
 depositing a first photoresist layer over the first seed layer, wherein the first photoresist layer is of a first predetermined pattern; 
 plating the conductive material over exposed portions of the first seed layer to form the antenna layer; 
 removing the first photoresist layer to expose the first seed layer under the first photoresist layer; and 
 after removing the first photoresist layer, applying a first etching process to remove exposed portions of the first seed layer. 
 
     
     
       17. The method for fabricating the AiP device of  claim 15 , further comprising:
 depositing a second photoresist layer over the second seed layer, wherein the second photoresist layer is of a second predetermined pattern; 
 plating the conductive material over exposed portions of the second seed layer to form the redistribution layer; 
 removing the second photoresist layer to expose the second seed layer under the second photoresist layer; and 
 after removing the second photoresist layer, applying a second etching process to remove the exposed portions of the second seed layer. 
 
     
     
       18. The method for fabricating the AiP device of  claim 15 , further comprising:
 attaching a plurality of input/output connectors to the redistribution layer, wherein the plurality of input/output connectors and the antenna layer are on the opposite sides of the semiconductor die. 
 
     
     
       19. The method for fabricating the AiP device of  claim 18 , wherein:
 at least one input/output connector of the plurality of input/output connectors is directly underneath the semiconductor die. 
 
     
     
       20. The method for fabricating the AiP device of  claim 13 , wherein the first circuit comprises a radio frequency (RF) circuit. 
     
     
       21. The method of  claim 1 , wherein the via formation process comprises a laser drilling process. 
     
     
       22. The method of  claim 1 , wherein the deposition process comprises chemical vapor deposition (CVD) or physical vapor deposition (PVD).