Inventor · disambiguated record
Eung San Cho
Also filed as: CHO EUNG SAN
104 granted patents·14 pending applications·293 citations·filing 2009–2024
99Inventor score
Files withINFINEON TECHNOLOGIES AMERICAS CORP50INT RECTIFIER CORP23INFINEON TECHNOLOGIES AG21CHO EUNG SAN15INFINEON TECHNOLOGIES AUSTRIA AG7
Top patents by PatentIndex Score
118 records- 0196US9190383B2Semiconductor package including a power stage and integrated output inductorINT RECTIFIER CORP·Filed 2015·Granted Nov 17, 2015·25 cites·20 claims
- 0296US8426952B2Stacked half-bridge package with a common conductive leadframeCHO EUNG SAN·Filed 2011·Granted Apr 23, 2013·25 cites·20 claims
- 0395US9583477B2Stacked half-bridge packageINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted Feb 28, 2017·10 cites·20 claims
- 0494US8497574B2High power semiconductor package with conductive clips and flip chip driver ICCHO EUNG SAN·Filed 2011·Granted Jul 30, 2013·12 cites·20 claims
- 0594US8344464B2Multi-transistor exposed conductive clip for high power semiconductor packagesINT RECTIFIER CORP·Filed 2011·Granted Jan 1, 2013·16 cites·20 claims
- 0693US9437570B2Power converter package with an integrated output inductorINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2014·Granted Sep 6, 2016·19 cites·20 claims
- 0793US9349677B2Stacked half-bridge package with a common leadframeINT RECTIFIER CORP·Filed 2013·Granted May 24, 2016·12 cites·20 claims
- 0893US8664754B2High power semiconductor package with multiple conductive clipsCHO EUNG SAN·Filed 2011·Granted Mar 4, 2014·11 cites·20 claims
- 0993US8497573B2High power semiconductor package with conductive clip on multiple transistorsCHO EUNG SAN·Filed 2011·Granted Jul 30, 2013·10 cites·20 claims
- 1092US8445999B2Direct contact leadless packageCHO EUNG SAN·Filed 2011·Granted May 21, 2013·10 cites·20 claims
- 1191US9640474B1Power semiconductor package having power semiconductor die in a support substrate with bar viasINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted May 2, 2017·8 cites·19 claims
- 1291US8531016B2Thermally enhanced semiconductor package with exposed parallel conductive clipCHO EUNG SAN·Filed 2011·Granted Sep 10, 2013·9 cites·20 claims
- 1390US11870130B2Antenna apparatus and fabrication methodINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 9, 2024·2 cites·20 claims
- 1490US8093695B2Direct contact leadless flip chip package for high current devicesCHO EUNG SAN·Filed 2009·Granted Jan 10, 2012·15 cites·16 claims
- 1589US9159703B2Power converter package including vertically stacked driver ICINT RECTIFIER CORP·Filed 2013·Granted Oct 13, 2015·8 cites·14 claims
- 1686US9565768B2Semiconductor package with integrated output inductor on a printed circuit boardINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted Feb 7, 2017·4 cites·20 claims
- 1786US8987883B2Semiconductor package with multiple conductive clipsINT RECTIFIER CORP·Filed 2014·Granted Mar 24, 2015·4 cites·18 claims
- 1885US11469164B2Space efficient and low parasitic half bridgeINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 11, 2022·2 cites·18 claims
- 1985US8674497B2Stacked half-bridge package with a current carrying layerCHO EUNG SAN·Filed 2011·Granted Mar 18, 2014·6 cites·20 claims
- 2084US10204873B2Breakable substrate for semiconductor dieINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2017·Granted Feb 12, 2019·4 cites·20 claims
- 2184US8749034B2High power semiconductor package with conductive clip and flip chip driver IC with integrated control transistorCHO EUNG SAN·Filed 2011·Granted Jun 10, 2014·4 cites·16 claims
- 2284US8614503B2Common drain exposed conductive clip for high power semiconductor packagesCHO EUNG SAN·Filed 2011·Granted Dec 24, 2013·7 cites·20 claims
- 2383US9111776B2Power semiconductor package with non-contiguous, multi-section conductive carrierINT RECTIFIER CORP·Filed 2014·Granted Aug 18, 2015·4 cites·20 claims
- 2482US11502012B2Semiconductor packages and methods of manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 15, 2022·1 cites·8 claims
- 2582US10818646B2Power stage device with carrier frame for power stage module and integrated inductorINFINEON TECHNOLOGIES AG·Filed 2019·Granted Oct 27, 2020·3 cites·20 claims
- 2682US10204847B2Multi-phase common contact packageINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted Feb 12, 2019·3 cites·20 claims
- 2782US9269655B2Method for fabricating a semiconductor package with conductive carrier integrated heat spreaderINT RECTIFIER CORP·Filed 2015·Granted Feb 23, 2016·3 cites·20 claims
- 2881US9831159B2Semiconductor package with embedded output inductorINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted Nov 28, 2017·4 cites·18 claims
- 2981US9515014B2Power converter package with integrated output inductorINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2015·Granted Dec 6, 2016·3 cites·19 claims
- 3081US8680627B2Stacked half-bridge package with a common conductive clipCHO EUNG SAN·Filed 2011·Granted Mar 25, 2014·4 cites·20 claims
- 3180US8987051B2Thermally enhanced semiconductor package with conductive clipINT RECTIFIER CORP·Filed 2013·Granted Mar 24, 2015·3 cites·20 claims
- 3279US11302610B2Semiconductor package and method of fabricating a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Apr 12, 2022·2 cites·8 claims
- 3378US12272862B2Antenna apparatus and fabrication methodINFINEON TECHNOLOGIES AG·Filed 2023·Granted Apr 8, 2025·0 cites·22 claims
- 3478US9911720B1Power switch packaging with pre-formed electrical connections for connecting inductor to one or more transistorsINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted Mar 6, 2018·2 cites·20 claims
- 3578US9331005B2Power semiconductor package with multi-section conductive carrierINT RECTIFIER CORP·Filed 2015·Granted May 3, 2016·2 cites·20 claims
- 3678US2024332099A1Semiconductor package having an electrically insulating core with exposed glass fibresINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 3777US12255114B2Embedded package with electrically isolating dielectric linerINFINEON TECHNOLOGIES AG·Filed 2023·Granted Mar 18, 2025·0 cites·8 claims
- 3877US10083884B2Compact high-voltage semiconductor packageINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2017·Granted Sep 25, 2018·2 cites·10 claims
- 3977US9824976B1Single-sided power device packageINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted Nov 21, 2017·2 cites·20 claims
- 4076US10135335B2Powerstage attached to inductorINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted Nov 20, 2018·2 cites·20 claims
- 4175US12014964B2Semiconductor package having an electrically insulating core with exposed glass fibresINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jun 18, 2024·0 cites·11 claims
- 4274US12300874B2Antenna package with via structure and method of formation thereofINFINEON TECHNOLOGIES AG·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 4373US10332825B2Semiconductor package including flip chip mounted IC and vertically integrated inductorINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted Jun 25, 2019·2 cites·12 claims
- 4473US9496168B2Semiconductor package with via-coupled power transistorsINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2015·Granted Nov 15, 2016·2 cites·20 claims
- 4573US9111921B2Semiconductor package with conductive carrier integrated heat spreaderINT RECTIFIER CORP·Filed 2013·Granted Aug 18, 2015·2 cites·14 claims
- 4672US8575737B2Direct contact semiconductor package with power transistorCHO EUNG SAN·Filed 2012·Granted Nov 5, 2013·2 cites·16 claims
- 4772US7994615B2Direct contact leadless package for high current devicesINT RECTIFIER CORP·Filed 2009·Granted Aug 9, 2011·3 cites·7 claims
- 4871US9653386B2Compact multi-die power semiconductor packageINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2014·Granted May 16, 2017·2 cites·15 claims
- 4971US9099452B2Semiconductor package with low profile switch node integrated heat spreaderINT RECTIFIER CORP·Filed 2014·Granted Aug 4, 2015·2 cites·20 claims
- 5069US9570379B2Power semiconductor package with integrated heat spreader and partially etched conductive carrierINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2014·Granted Feb 14, 2017·2 cites·22 claims
Showing the top 50 of 118 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →