Inventor

SAWLE ANDREW N

GB22 patents

⚠️ This page may combine multiple inventors who share the name “SAWLE ANDREW N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAWLE ANDREW N

INFINEON TECHNOLOGIES AMERICAS CORP

Stacked half-bridge package

Method for fabricating a power semiconductor package including vertically stacked driver IC

Semiconductor package including a semiconductor die having redistributed pads

Method for fabricating a semiconductor package with conductive carrier integrated heat spreader

Stacked half-bridge package

Power semiconductor package having vertically stacked driver IC

Power semiconductor package with a common conductive clip

Semiconductor package including conductive carrier coupled power switches

INT RECTIFIER CORP

Stacked half-bridge package with a common leadframe

Power converter package including vertically stacked driver IC

Surface mounted package with die bottom spaced from support board

Method for fabricating a semiconductor package with conductive carrier integrated heat spreader

Semiconductor package with conductive carrier integrated heat spreader

Power converter package including top-drain configured power FET

Half-bridge package with a conductive clip

CHO EUNG SAN

Stacked half-bridge package with a common conductive leadframe

Stacked half-bridge package with a current carrying layer

Stacked half-bridge package with a common conductive clip

MA LING

Buck converter power package

CARROLL MARTIN

Protective barrier layer for semiconductor device electrodes

FARLOW ANDY

Chip-scale package

PAVIER MARK

Semiconductor package including a semiconductor die having redistributed pads